Fan, Chun Ho
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1

Direct Die to Wafer Cu Hybrid Bonding for Volume Production:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Fan, Chun Ho ; Ng, Hoi Ping ; So, Siu Cheung... - p. 91-96 , 2023
 
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2

Voids-free Die-level Cu/ILD Hybrid bonding:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sakuma, Katsuyuki ; Yu, Roy ; Polomoff, Nicholas... - p. 800-805 , 2023
 
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4

Optimization of packaging process in Ag sintering for ultra..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
 
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5

Surface Energy Characterization for Die-Level Cu Hybrid Bon..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Sakuma, Katsuyuki ; Yu, Roy ; Belyansky, Michael... - p. 312-316 , 2022
 
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7

Suppression Effect of Gamma-Valerolactone on the Mild Alkal..:

Fan, Yafeng ; Li, Lianhua ; Yang, Gaixiu...
ACS Sustainable Chemistry & Engineering.  9 (2021)  44 - p. 14846-14856 , 2021
 
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9

Efficient and Accurate Quantized Image Super-Resolution on ..:

, In: Lecture Notes in Computer Science; Computer Vision – ECCV 2022 Workshops,
Ignatov, Andrey ; Timofte, Radu ; Denna, Maurizio... - p. 92-129 , 2023
 
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11

Applying the total carbon–black carbon approach method to i..:

Katoch, Ankita ; Abbass, Muneer ; Chen, Yi-Wen...
Science of The Total Environment.  936 (2024)  - p. 173476 , 2024
 
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12

Modulation of experimental acute lung injury by exosomal mi..:

Lin, Wei-Ting ; Wu, Hao-Hsiang ; Lee, Chien-Wei...
Molecular Therapy - Nucleic Acids.  35 (2024)  1 - p. 102102 , 2024
 
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13

1. Confluence of Fears: The 1923 Doomsday Hysteria in China:

, In: Chinese Popular Religion in Text and Acts,
Fan, Chun-wu ; Ho, Eunice - p. 43-62 , 2023
 
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