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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Direct Die to Wafer Cu Hybrid Bonding for Volume Production:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
2
Voids-free Die-level Cu/ILD Hybrid bonding:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
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Optimization of packaging process in Ag sintering for ultra..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Surface Energy Characterization for Die-Level Cu Hybrid Bon..:
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Lecture Notes in Computer Science; Computer Vision – ECCV 2022 Workshops ,
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Efficient and Accurate Quantized Image Super-Resolution on ..:
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Chinese Popular Religion in Text and Acts ,
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