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Fang, Jau-Shiung
153
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Search for persons
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Online (153)
Mediatypes
Articles (Online) (132)
Bookchapter (Online) (2)
OpenAccess-fulltext (19)
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?
1
Synergistic enhancement of adhesion and electromigration re..:
Fang, Jau-Shiung
;
Su, Ting-Hsun
;
Cheng, Yi-Lung
.
Microelectronics Reliability. 158 (2024) - p. 115427 , 2024
Link:
https://doi.org/10.1016/..
?
2
Process optimization of titanium self-aligned silicide form..:
Gau, In-Chi
;
Chang, Yao-Wen
;
Chen, Giin-Shan
..
Solid-State Electronics. 215 (2024) - p. 108879 , 2024
Link:
https://doi.org/10.1016/..
?
3
The feasibility of an ultrathin dual-barrier scheme to inhi..:
Hsiao, Chien-Nan
;
Pan, Yen-Chang
;
Chen, Wei-Chun
...
Surfaces and Interfaces. 51 (2024) - p. 104703 , 2024
Link:
https://doi.org/10.1016/..
?
4
Understanding electromigration failure behaviors of narrow ..:
Fang, Jau-Shiung
;
Chen, Giin-Shan
;
Chang, Chin-Chia
...
Journal of Alloys and Compounds. 970 (2024) - p. 172591 , 2024
Link:
https://doi.org/10.1016/..
?
5
Layer-by-layer deposition of breakdown-strengthened Co(Ni) ..:
Fang, Jau-Shiung
;
Chen, Kun-Huang
;
Cheng, Yi-Lung
.
Materials Chemistry and Physics. 296 (2023) - p. 127222 , 2023
Link:
https://doi.org/10.1016/..
?
6
Comparison of Barrier Efficiency for Self-Assembled Monolay..:
Cheng, Yi-Lung
;
Lee, Chih-Yen
;
Chen, Giin-Shan
.
ECS Journal of Solid State Science and Technology. 12 (2023) 12 - p. 123009 , 2023
Link:
https://doi.org/10.1149/..
?
7
Dual near-zero-thickness sealing for the strengthening of c..:
Chen, Giin-Shan
;
Pan, Yen-Chang
;
Chen, Wei-Chun
...
Applied Surface Science. 609 (2023) - p. 155387 , 2023
Link:
https://doi.org/10.1016/..
?
8
Reliability Characteristics of Metal-Insulator-Semiconducto..:
Cheng, Yi-Lung
;
Peng, Wei-Fan
;
Huang, Chi-Jia
..
Molecules. 28 (2023) 3 - p. 1134 , 2023
Link:
https://doi.org/10.3390/..
?
9
Comparison of Cobalt Integration with Various Dielectric Ma..:
Cheng, Yi-Lung
;
Huang, Hong-Chang
;
Peng, Wei-Fan
..
Coatings. 13 (2023) 10 - p. 1818 , 2023
Link:
https://doi.org/10.3390/..
?
10
Comparison of Precursors for Self-Assembled Monolayers as C..:
Cheng, Yi-Lung
;
Lee, Chih-Yen
;
Chen, Giin-Shan
.
ECS Journal of Solid State Science and Technology. , 2023
Link:
https://doi.org/10.1149/..
?
11
Reinforcement in electromigration reliability of Cu interco..:
Fang, Jau-Shiung
;
Lee, Ching-En
;
Cheng, Yi-Lung
.
Journal of Alloys and Compounds. 951 (2023) - p. 169974 , 2023
Link:
https://doi.org/10.1016/..
?
12
Comparison of CoW/SiO2 and CoB/SiO2 Interconnects from the ..:
Cheng, Yi-Lung
;
Wang, Kai-Hsieh
;
Lee, Chih-Yen
..
Materials. 16 (2023) 4 - p. 1452 , 2023
Link:
https://doi.org/10.3390/..
?
13
Enhancement of Electromigration Reliability of Electroless-..:
Chen, Giin-Shan
;
Lee, Ching-En
;
Cheng, Yi-Lung
...
Journal of The Electrochemical Society. 169 (2022) 8 - p. 082519 , 2022
Link:
https://doi.org/10.1149/..
?
14
Comparison of Self-Assembled Monolayers on SiO2 and Porous ..:
Cheng, Yi-Lung
;
Peng, Wei-Fan
;
Lee, Chih-Yen
..
Coatings. 12 (2022) 7 - p. 926 , 2022
Link:
https://doi.org/10.3390/..
?
15
Enhancement of breakdown strength and electromigration reli..:
Tsai, Ting-Kan
;
Shih, I-Ting
;
Cheng, Yi-Lung
..
Materials Chemistry and Physics. 285 (2022) - p. 126136 , 2022
Link:
https://doi.org/10.1016/..
1-15