E-LIB Suche - Ergebnisse für: Farooq, Mukta

1

CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling ..:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),

Miyazawa, Risa ; Mori, Hiroyuki ; Jain, Aakrati.. - p. 1-8 , 2023

Link: https://doi.org/10.1109/..

2

Next Generation Infrared (IR) Laser Debonding / Silicon Han..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Chen, Qianwen ; Belyansky, Michael ; Sulehria, Yasir... - p. 1175-1180 , 2023

Link: https://doi.org/10.1109/..

3

Thermal solution for Co-Packaged Optics (CPO) modules:

, In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),

Matsumoto, Keiji ; Farooq, Mukta ; Knickerbocker, John - p. 1-3 , 2022

Link: https://doi.org/10.1109/..

4

Functional Testing of AI Cores through Thinned 3D I/O Buffe..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Farooq, Mukta ; Kumar, Arvind ; Lee, Sae-Kyu... - p. 977-980 , 2022

Link: https://doi.org/10.1109/..

5

Spatial and temporal thermal characterization of stacked mu..:

Kursun, Eren ; Wakil, Jamil ; Farooq, Mukta.
ACM Journal on Emerging Technologies in Computing Systems. 8 (2012) 3 - p. 1-17 , 2012

Link: https://doi.org/10.1145/..

6

Spatial and temporal thermal characterization of stacked mu..:

Kursun, Eren ; Wakil, Jamil ; Farooq, Mukta.
ACM Journal on Emerging Technologies in Computing Systems (JETC). 8 (2012) 3 - p. 1-17 , 2012

Link: https://dl.acm.org/doi/1..

7

Lead-free ceramic ball grid array: Thermomechanical fatigue..:

Farooq, Mukta ; Goldsmith, Charles ; Jackson, Ray.
Journal of Electronic Materials. 32 (2003) 12 - p. 1421-1425 , 2003

Link: https://doi.org/10.1007/..

8

Thermal Characterization of 3-D Stacked Heterogeneous Integ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Jain, Aakrati ; Miyazawa, Risa ; Raghavan, Sathya... - p. 1219-1225 , 2023

Link: https://doi.org/10.1109/..

9

Modeling of the Temperature Profile and Residual Stress Dur..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Chowdhury, Prabudhya Roy ; Raghavan, Sathya ; Darling, Luke... - p. 1418-1425 , 2023

Link: https://doi.org/10.1109/..

10

(Invited) 3D Integration in Silicon Technology:

Farooq, Mukta G.
ECS Transactions. 35 (2011) 2 - p. 83-94 , 2011

Link: https://doi.org/10.1149/..

11

3D integration review:

Farooq, Mukta G. ; Iyer, Subramanian S.
Science China Information Sciences. 54 (2011) 5 - p. 1012-1025 , 2011

Link: https://doi.org/10.1007/..

12

Schottky device behavior of n-Si/Pd2Si/Al and n-Si/CoSi2/Al..:

Farooq, Mukta S. ; Murarka, Shyam P.
Materials Science and Engineering: B. 19 (1993) 3 - p. 270-275 , 1993

Link: https://doi.org/10.1016/..

13

Contributors:

, In: QTL Mapping in Crop Improvement,

Agrawal, Nisha ; Ajay, B.C. ; Amrate, Pawan Kumar... - p. ix-xii , 2022

Link: https://doi.org/10.1016/..