E-LIB Suche - Ergebnisse für: Feng, Jiayun

1

Recent progress in polyaniline-based chemiresistive flexibl..:

Wen, Jiayue ; Wang, Shang ; Feng, Jiayun...
Journal of Materials Chemistry A. 12 (2024) 11 - p. 6190-6210 , 2024

Link: https://doi.org/10.1039/..

2

Solder joint shape optimization and thermal-mechanical reli..:

Li, Geng ; Wang, Shang ; Ding, Ying...
Microelectronics Reliability. 154 (2024) - p. 115345 , 2024

Link: https://doi.org/10.1016/..

3

A novel Cu@Ag nano paste with low porosity for rapidly sint..:

Wang, Kaifeng ; Wen, Jiayue ; Feng, Jiayun...
Materials Characterization. 209 (2024) - p. 113762 , 2024

Link: https://doi.org/10.1016/..

4

Graphene Oxide-Based Planar Hygroelectric Generator and Its..:

Feng, Jiayun ; Wen, Jiayue ; Wang, Shang...
ACS Applied Nano Materials. 7 (2024) 2 - p. 1646-1654 , 2024

Link: https://doi.org/10.1021/..

5

Room temperature synthesis and hydrophobic surface protecti..:

Wen, Jiayue ; Feng, Jiayun ; Meng, Fanzhou...
Sensors and Actuators A: Physical. 369 (2024) - p. 115075 , 2024

Link: https://doi.org/10.1016/..

6

A Manufacturing Method for High-Reliability Multilayer Flex..:

Li, Geng ; Wang, Shang ; Wen, Jiayue...
Coatings. 14 (2024) 5 - p. 625 , 2024

Link: https://doi.org/10.3390/..

7

Microconfined Assembly of High‐Resolution and Mechanically ..:

Ma, Jingxuan ; Sa, Zicheng ; Zhang, He...
Advanced Science. , 2024

Link: https://doi.org/10.1002/..

8

Mechanical properties degradation of Sn 37Pb solder joints ..:

Tian, Ruyu ; Chen, Shuai ; Feng, Jiayun...
Materials Characterization. 201 (2023) - p. 112979 , 2023

Link: https://doi.org/10.1016/..

9

Novel Cu@Ag Micro/Nanoparticle Hybrid Paste and Its Rapid S..:

Wu, Zhuohuan ; Liu, Wei ; Feng, Jiayun...
ACS Omega. 8 (2023) 34 - p. 31021-31029 , 2023

Link: https://doi.org/10.1021/..

10

Study on low temperature sintering mechanism and performanc..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),

Wang, Yiping ; Yang, Dongsheng ; Wu, Peng... - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

11

Study on the interfacial IMCs growth of nt-Cu/In solder joi..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),

Sa, Zicheng ; Liu, Xudong ; Wang, Shang.. - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

12

Hydrothermally Synthesized Vanadium Diselenide: A Cathode A..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),

Wang, Xinxin ; Wang, Shang ; Feng, Yan... - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

13

Flexible Electronic Systems via Electrohydrodynamic Jet Pri..:

Wang, Shang ; Zeng, Guifang ; Sun, Qing...
ACS Nano. , 2023

Link: https://doi.org/10.1021/..

14

Electrohydrodynamic Printing of High‐Resolution Self‐Reduce..:

Hu, Xuanyi ; Feng, Jiayun ; Zhang, He...
Advanced Materials Technologies. 8 (2023) 19 - p. , 2023

Link: https://doi.org/10.1002/..

15

Effects of age-related changes in trunk and lower limb rang..:

Zhai, Meiling ; Huang, Yongchao ; Zhou, Shi...
BMC Musculoskeletal Disorders. 24 (2023) 1 - p. , 2023

Link: https://doi.org/10.1186/..