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1

Al3Sc thin films for advanced interconnect applications:

Soulié, Jean-Philippe ; Sankaran, Kiroubanand ; Founta, Valeria...
Microelectronic Engineering. 286 (2024) - p. 112141 , 2024

Link: https://doi.org/10.1016/..

2

Ru Stress Assessment by Membrane Wrinkling for Interconnect..:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),

Founta, Valeria ; Soulie, Jean-Philippe ; De Wolf, Ingrid... - p. 1-3 , 2023

Link: https://doi.org/10.1109/..

3

Stress and thermal stress evolution in Mo and Ru thin films:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),

Founta, Valeria ; Soulie, Jean-Philippe ; Dutta, Shibesh... - p. 70-72 , 2022

Link: https://doi.org/10.1109/..

4

Properties of ultrathin molybdenum films for interconnect a..:

Founta, Valeria ; Soulié, Jean-Philippe ; Sankaran, Kiroubanand...
Materialia. 24 (2022) - p. 101511 , 2022

Link: https://doi.org/10.1016/..

5

Al$_3$Sc thin films for advanced interconnect applications:

Soulié, Jean-Philippe ; Sankaran, Kiroubanand ; Founta, Valeria...
http://arxiv.org/abs/2310.20485. , 2023

Link: http://arxiv.org/abs/231..

6

Ανάπτυξη τριστρωματικού λεπτού υμενίου Al-Al2O3-Al για τη μ..:

Φούντα, Βαλέρια ; Founta, Valeria
http://dspace.lib.ntua.gr/xmlui/handle/123456789/45694. , 2017

Link: http://dspace.lib.ntua.g..

7

Σύνθεση και δομικός χαρακτηρισμός νανοσυρμάτων χαλκού και κ..:

Φούντα, Βαλέρια ; Founta, Valeria
https://dspace.lib.ntua.gr/xmlui/handle/123456789/49864. ,

Link: https://dspace.lib.ntua...

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