Franzon, Paul D.
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1

High-Speed Receiver Transient Modeling with Generative Adve..:

, In: 2024 IEEE 33rd Microelectronics Design & Test Symposium (MDTS),
 
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2

DepthGraphNet: Circuit Graph Isomorphism Detection via Siam..:

, In: 2023 ACM/IEEE 5th Workshop on Machine Learning for CAD (MLCAD),
 
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3

Chiplet Set For Artificial Intelligence:

, In: 2023 IEEE International 3D Systems Integration Conference (3DIC),
 
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4

System Aware Floorplanning for Chip-Package Co-design:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
 
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5

Generative Multi-Physics Models for System Power and Therma..:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
 
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6

Thermal Cycling and Fatigue Life Analysis of a Laterally Co..:

, In: 2023 IEEE International 3D Systems Integration Conference (3DIC),
 
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7

Thermal Estimation for 3D-ICs Through Generative Networks:

, In: 2023 IEEE International 3D Systems Integration Conference (3DIC),
 
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8

Generative Adversarial Network Based Adaptive Transmitter M..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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9

FAXID: FPGA-Accelerated XGBoost Inference for Data Centers ..:

, In: 2022 IEEE 30th Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM),
 
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10

RxGAN: Modeling High-Speed Receiver through Generative Adve..:

, In: Proceedings of the 2022 ACM/IEEE Workshop on Machine Learning for CAD,
Kashyap, Priyank ; Gajjar, Archit ; Choi, Yongjin... - p. 167-172 , 2022
 
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12

High Dimensional Optimization for Electronic Design:

, In: Proceedings of the 2022 ACM/IEEE Workshop on Machine Learning for CAD,
Wen, Yuejiang ; Dean, Jacob ; Floyd, Brian A.. - p. 153-157 , 2022
 
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13

RxGAN: Modeling High-Speed Receiver through Generative Adve..:

, In: 2022 ACM/IEEE 4th Workshop on Machine Learning for CAD (MLCAD),
Kashyap, Priyank ; Gajjar, Archit ; Choi, Yongjin... - p. 167-172 , 2022
 
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14

Modeling of Adaptive Receiver Performance Using Generative ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kashyap, Priyank ; Choi, Yongjin ; Dey, Sumon... - p. 1958-1963 , 2022
 
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15

Design Obfuscation Through 3-D Split Fabrication With Smart..:

Nigussie, Theodros ; Schabel, Josh C. ; Lipa, Steve...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  30 (2022)  9 - p. 1230-1243 , 2022
 
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