Fuse, Junya
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1

Low Temperature Wafer Level Hybrid Bonding Enabled by Advan..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Inoue, Fumihiro ; Nagata, Atsushi ; Fuse, Junya... - p. 69-75 , 2024
 
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2

In-Depth Analysis of Bonding Interface at Die Level Hybrid ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Yoshihara, Yuki ; Fuse, Junya ; Iwata, Tomoya... - p. 3-4 , 2024
 
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3

Exploring Bond Strength for Advanced Chiplet with Hybrid Bo..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Fuse, Junya ; Iwata, Tomoya ; Yoshihara, Yuki.. - p. 199-203 , 2023
 
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4

Robust Measurement of Bonding Strength for Wafer-to-Wafer 3..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Fuse, Junya ; Iwata, Tomoya ; Ebiko, Sodai. - p. 105-106 , 2023
 
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6

Comparison of transplant outcomes between haploidentical tr..:

Matsuda, Kensuke ; Konuma, Takaaki ; Fuse, Kyoko...
British Journal of Haematology.  201 (2022)  1 - p. 106-113 , 2022
 
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8

Impact of Coronavirus Disease 2019 on Time Delay and Functi..:

Katsumata, Masahiro ; Ota, Takahiro ; Kaneko, Junya...
Journal of Stroke and Cerebrovascular Diseases.  30 (2021)  10 - p. 106051 , 2021
 
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9

Defining the Term "Elderly" in the Field of Surgery: A Retr..:

Izumisawa, Yusuke ; Morioka, Daisuke ; Fuse, Masahiro...
Surgical Laparoscopy, Endoscopy & Percutaneous Techniques.  30 (2020)  5 - p. 435-440 , 2020
 
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11

Conservation of the Nrf2-Mediated Gene Regulation of Protea..:

Nguyen, Vu Thanh ; Fuse, Yuji ; Tamaoki, Junya...
Oxidative Medicine and Cellular Longevity.  2016 (2016)  - p. 1-10 , 2016
 
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