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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Low Temperature Wafer Level Hybrid Bonding Enabled by Advan..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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In-Depth Analysis of Bonding Interface at Die Level Hybrid ..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Exploring Bond Strength for Advanced Chiplet with Hybrid Bo..:
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2023 International Conference on Electronics Packaging (ICEP) ,
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