Search for persons
X
?
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
1
Reliability Performance Study of Molding Compounds on High ..:
, In:
?
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
2
Reliability Studies of Novel Au-coated Ag (ACA) Bonding Wir..:
, In:
?
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
3
Adhesion and Reliability Study of Different EMC and Pre-pla..:
, In:
?
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
4
Thermo-mechanical Characterization and Stress Simulation of..:
, In:
?
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
5
Enabling MSL1 Zero Delamination through Advanced Packaging ..:
, In:
?
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
6
Epoxy Molding Compound Development for Improved MSL1 Delami..:
, In:
?
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
7
Epoxy Mold Compound Curing Behavior and Mold Process Cure T..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
8