Garete, April Joy
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1

Reliability Performance Study of Molding Compounds on High ..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Garete, April Joy ; Li, Zhiwen ; Fung, Yee Wai. - p. 67-70 , 2023
 
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2

Reliability Studies of Novel Au-coated Ag (ACA) Bonding Wir..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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3

Adhesion and Reliability Study of Different EMC and Pre-pla..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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4

Thermo-mechanical Characterization and Stress Simulation of..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Li, Zhiwen ; Garete, April Joy ; Zhou, Zhou... - p. 585-588 , 2022
 
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5

Enabling MSL1 Zero Delamination through Advanced Packaging ..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Garete, April Joy ; Li, Zhiwen ; Taduran, Arnel. - p. 99-102 , 2020
 
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6

Epoxy Molding Compound Development for Improved MSL1 Delami..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
 
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7

Epoxy Mold Compound Curing Behavior and Mold Process Cure T..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
 
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8

Reliability of Ag bonding wires and its coated variants fro..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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