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Gaudin, Gweltaz
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1

150 mm SiC Engineered Substrates for High-Voltage Power Dev..:

Rouchier, Séverin ; Gaudin, Gweltaz ; Widiez, Julie...
Materials Science Forum.  1062 (2022)  - p. 131-135 , 2022
Link: https://doi.org/10.4028/..
 
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2

(Keynote) Low Temperature SmartCutTM Process for 3D Integra..:

Schwarzenbach, Walter ; Reboh, Shay ; Ghorbel, Aymen...
ECS Transactions.  97 (2020)  5 - p. 129-133 , 2020
Link: https://doi.org/10.1149/..
 
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3

Low temperature junctionless device stacking enabled by lea..:

, In: 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA),
Besnard, Guillaume ; Gaudin, Gweltaz ; Schwarzenbach, Walter... - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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4

InGaAs-OI Substrate Fabrication on a 300 mm Wafer:

Sollier, Sebastien ; Widiez, Julie ; Gaudin, Gweltaz...
Journal of Low Power Electronics and Applications.  6 (2016)  4 - p. 19 , 2016
Link: https://doi.org/10.3390/..
 
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5

300 mm InGaAs-on-insulator substrates fabricated using dire..:

Widiez, Julie ; Sollier, Sébastien ; Baron, Thierry...
Japanese Journal of Applied Physics.  55 (2016)  4S - p. 04EB10 , 2016
Link: https://doi.org/10.7567/..
 
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6

Physical and Electrical Properties of Thin Doped Silicon Fi..:

Gaudin, Gweltaz ; Van Den Daele, William ; Chartrain, Nicholas...
ECS Journal of Solid State Science and Technology.  2 (2013)  12 - p. P534-P538 , 2013
Link: https://doi.org/10.1149/..
 
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7

(Invited) Low Temperature Direct Bonding 3D Stacking Techno..:

Di Cioccio, Lea ; Radu, Ionut ; Gaudin, Gweltaz...
ECS Transactions.  58 (2013)  9 - p. 17-28 , 2013
Link: https://doi.org/10.1149/..
 
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8

Wafer Level 3D Stacking Using Smart Cut and Metal-Metal Dir..:

Di Cioccio, Lea ; Radu, Ionut ; Baudin, Floriane...
ECS Transactions.  50 (2013)  7 - p. 169-175 , 2013
Link: https://doi.org/10.1149/..
 
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9

InGaAs-OI Substrate Fabrication on a 300 mm Wafer:

Sebastien Sollier ; Julie Widiez ; Gweltaz Gaudin...
http://www.mdpi.com/2079-9268/6/4/19.  , 2016
Link: https://doi.org/10.3390/..
 
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10

InGaAs-OI Substrate Fabrication on a 300 mm Wafer:

Sebastien Sollier ; Julie Widiez ; Gweltaz Gaudin...
https://dx.doi.org/10.3390/jlpea6040019.  , 2016
Link: https://doi.org/10.3390/..
 
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