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Gerets, Carine
11  results:
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1

3D interconnects for quantum computing:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Dangol, Anish ; Hussain, Tassawar... - p. 821-828 , 2024
Link: https://doi.org/10.1109/..
 
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2

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Ye ; Bex, Pieter ; Kennes, Koen... - p. 40-44 , 2024
Link: https://doi.org/10.1109/..
 
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3

Developing TSV wet cleaning chemistry for quantum computing..:

Le Tulzo, Harold ; Celeste, Loriana ; Tendero, Inès...
Microelectronic Engineering.  276 (2023)  - p. 112010 , 2023
Link: https://doi.org/10.1016/..
 
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4

Confined IMCs for low temperature and high throughput D2W b..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Derakhshandeh, Jaber ; La Tulipe, Douglas Charles ; Capuz, Giovanni... - p. 131-132 , 2022
Link: https://doi.org/10.23919..
 
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5

Low temperature backside damascene processing on temporary ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Beyne, Eric ; Beyer, Gerald... - p. 1108-1113 , 2022
Link: https://doi.org/10.1109/..
 
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6

Fundamental study of IMC grains at low anneal temperature:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Gerets, Carine ; Derakhshandeh, Jaber ; Shafahian, Ehsan... - p. 133-134 , 2022
Link: https://doi.org/10.23919..
 
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7

10 and 7 μm Pitch Thermo-compression Solder Joint, Using A ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Capuz, Giovanni ; Cherman, Vladimir... - p. 617-622 , 2020
Link: https://doi.org/10.1109/..
 
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8

Process development and characterization of 3D multi-die st..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Gerets, Carine ; Derakhshandeh, Jaber ; Bex, Pieter... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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9

ELD NiB for microbumps passivation and wirebonding:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Derakhshandeh, Jaber ; De Preter, Inge ; El-Mekki, Zaid... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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10

Thermal Management and Processing Optimization for 3D Multi..:

, In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
Lofrano, Melina ; Cherman, Vladimir ; Gerets, Carine.. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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11

3D Stacking Using Bump-Less Process for Sub 10um Pitch Inte..:

, In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; De Preter, Inge ; Gerets, Carine... - p. 128-133 , 2016
Link: https://doi.org/10.1109/..
 
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