Search for persons
X
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
3D interconnects for quantum computing:
, In:
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies ..:
, In:
?
2022 International Conference on Electronics Packaging (ICEP) ,
4
Confined IMCs for low temperature and high throughput D2W b..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
5
Low temperature backside damascene processing on temporary ..:
, In:
?
2022 International Conference on Electronics Packaging (ICEP) ,
6
Fundamental study of IMC grains at low anneal temperature:
, In:
?
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
7
10 and 7 μm Pitch Thermo-compression Solder Joint, Using A ..:
, In:
?
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
8
Process development and characterization of 3D multi-die st..:
, In:
?
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
9
ELD NiB for microbumps passivation and wirebonding:
, In:
?
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ,
10
Thermal Management and Processing Optimization for 3D Multi..:
, In:
?
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ,
11