Glavanovics, M.
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1

A common hard-failure mechanism in GaN HEMTs in accelerated..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Wieland, D. ; Ofner, S. ; Stabentheiner, M.... - p. 1-6 , 2023
 
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4

Modular application relevant stress testing for next genera..:

Sievers, M. ; Glavanovics, M. ; Rhinow, C..
Microelectronics Reliability.  100-101 (2019)  - p. 113330 , 2019
 
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A reliable technology concept for active power cycling to e..:

Nelhiebel, M. ; Illing, R. ; Schreiber, C....
Microelectronics Reliability.  51 (2011)  9-11 - p. 1927-1932 , 2011
 
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9

Transient thermo-mechanical analysis of smart power switche..:

Košel, V ; Držík, M ; Šatka, A...
Measurement Science and Technology.  22 (2010)  1 - p. 015704 , 2010
 
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