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Guan, Chen Gim
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1

Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cheemalamarri, Hemanth Kumar ; Van Nhat Anh, Tran ; Guan, Chen Gim... - p. 1880-1884 , 2024
Link: https://doi.org/10.1109/..
 
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2

Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cheemalamarri, Hemanth Kumar ; Sundaram, Arvind ; Sandra, San... - p. 803-808 , 2024
Link: https://doi.org/10.1109/..
 
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3

Cu and barrier CMP process development with fine 1μm Cu bon..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Roy, Sangita Chaki ; Guan, Chen Gim ; Venkataraman, Nandini.. - p. 135-138 , 2023
Link: https://doi.org/10.1109/..
 
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4

Electrical Characterization and Reliability Studies of Nano..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Tseng, Ya-Ching ; Chui, King-Jien ; Goh, Simon Chun Kiat... - p. 1581-1586 , 2024
Link: https://doi.org/10.1109/..
 
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5

Process Development and Integration for Wafer-to-Wafer Hybr..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Li, Hongyu ; Ji, Hong Miao ; Chen, Gim Guan... - p. 01-04 , 2022
Link: https://doi.org/10.1109/..
 
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6

Cu CMP Dishing Control for Fine Pitch Wafer-to-Wafer (W2W) ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Ji, Hong Miao ; Chen, Gim Guan ; Chui, K.-J. - p. 951-954 , 2022
Link: https://doi.org/10.1109/..
 
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7

Optimization of the CMP process for direct wafer-to-wafer o..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Ji, Hong-Miao ; Cheemalamarri, Hemanth Kumar ; Chi, Ting-Ta... - p. 421-424 , 2023
Link: https://doi.org/10.1109/..
 
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8

A gesture control system for intuitive 3D interaction with ..:

Manders, Corey ; Farbiz, Farzam ; Yin, Tang Ka..
Computer Animation and Virtual Worlds.  21 (2010)  2 - p. 117-129 , 2010
Link: https://doi.org/10.1002/..
 
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9

Interacting with 3D objects in a virtual environment using ..:

, In: Proceedings of The 7th ACM SIGGRAPH International Conference on Virtual-Reality Continuum and Its Applications in Industry,
Manders, Corey ; Farbiz, Farzam ; Yin, Tang Ka... - p. 1-5 , 2008
Link: https://dl.acm.org/doi/1..
 
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10

The Brain Bench: virtual tools for stereotactic frame neuro..:

Serra, Luis ; Nowinski, Wieslaw L. ; Poston, Timothy...
Medical Image Analysis.  1 (1997)  4 - p. 317-329 , 1997
Link: https://doi.org/10.1016/..
 
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11

Growth of nickel-base superalloy bicrystals by the seeding ..:

Chen, Gim S. ; Aimone, Paul R. ; Gao, Ming..
Journal of Crystal Growth.  179 (1997)  3-4 - p. 635-646 , 1997
Link: https://doi.org/10.1016/..
 
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12

A technique for studying the 3-dimensional shape of corrosi..:

Liao, Chi-Min ; Chen, Gim S. ; Wei, Robert P.
Scripta Materialia.  35 (1996)  11 - p. 1341-1346 , 1996
Link: https://doi.org/10.1016/..
 
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13

Effect of Dissolved Ozone and In-Situ Wafer Cleaning on Pre..:

, In: 2020 China Semiconductor Technology International Conference (CSTIC),
Kashkoush, Ismail ; Waugh, Darian ; Chen, Gim - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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14

A New Approach to Tackle Wafer Contact Mark Contamination I..:

Chen, Gim ; Nemeth, Dennis ; Kashkoush, Ismail
ECS Transactions.  92 (2019)  2 - p. 117-123 , 2019
Link: https://doi.org/10.1149/..
 
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15

Application of In-situ Pre-epi Clean Process for Next Gener..:

, In: 2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS),
Waugh, Darian ; Chen, Gim ; Boecker, Jennifer. - p. 14-17 , 2019
Link: https://doi.org/10.1109/..
 
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