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Hölck, Ole
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1

In-Package Characterization of Dielectrics Using Ring Reson..:

, In: 2024 15th German Microwave Conference (GeMiC),
Stadler, Pascal ; Braun, Tobias T. ; Geissler, Christian... - p. 272-275 , 2024
Link: https://doi.org/10.23919..
 
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2

How to Manipulate Warpage in Fan-out Wafer and Panel Level ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Holck, Ole ; Adler, Marius... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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3

A Closer Look to Fan-out Panel Level Packaging:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Braun, Tanja ; Holck, Ole ; Voitel, Marcus... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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4

Improving Warpage Characterization of Large Wafers in Fan-O..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huber, Saskia ; Stegmaier, Andreas ; van Dijk, Marius... - p. 1332-1338 , 2023
Link: https://doi.org/10.1109/..
 
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5

Warpage of Fan-Out Panel Level Packaging – Experimental and..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Stegmaier, Andreas ; Holck, Ole ; Dijk, Marius van... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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6

In-situ infrared spectroscopy for chemical analysis in elec..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Niegisch, Corinna ; Haag, Sabine ; Braun, Tanja.. - p. 336-342 , 2022
Link: https://doi.org/10.1109/..
 
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7

Thin Film Encapsulation for LCP-Based Flexible Bioelectroni..:

Pak, Anna ; Nanbakhsh, Kambiz ; Hölck, Ole...
Micromachines.  13 (2022)  4 - p. 544 , 2022
Link: https://doi.org/10.3390/..
 
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8

Panel Level Packaging – Where are the Technology Limits?:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Holck, Ole ; Obst, Mattis... - p. 807-818 , 2022
Link: https://doi.org/10.1109/..
 
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9

Cure Kinetics Modeling of a High Glass Transition Temperatu..:

Franieck, Erick ; Fleischmann, Martin ; Hölck, Ole..
Polymers.  13 (2021)  11 - p. 1734 , 2021
Link: https://doi.org/10.3390/..
 
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10

Towards nanoreliability of sensors incorporating interfaces..:

Hartmann, Steffen ; Hermann, Sascha ; Bonitz, Jens...
Mechatronics.  40 (2016)  - p. 270-280 , 2016
Link: https://doi.org/10.1016/..
 
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11

Experimental and computational studies on the role of surfa..:

Hartmann, Steffen ; Sturm, Heinz ; Blaudeck, Thomas...
Journal of Materials Science.  51 (2015)  3 - p. 1217-1233 , 2015
Link: https://doi.org/10.1007/..
 
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12

Mechanics of CNT-palladium Interfaces for Sensor Applicatio..:

Hartmann, Steffen ; Hölck, Ole ; Wunderle, Bernhard
Procedia Materials Science.  3 (2014)  - p. 454-460 , 2014
Link: https://doi.org/10.1016/..
 
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13

Gas sorption isotherms in swelling glassy polymers—Detailed..:

Hölck, Ole ; Böhning, Martin ; Heuchel, Matthias..
Journal of Membrane Science.  428 (2013)  - p. 523-532 , 2013
Link: https://doi.org/10.1016/..
 
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14

Multiscale perspectives of interface delamination in microe..:

Iwamoto, Nancy ; Hölck, Ole ; Noijen, Sander
Molecular Simulation.  37 (2011)  8 - p. 710-717 , 2011
Link: https://doi.org/10.1080/..
 
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15

Simulation of experimentally observed dilation phenomena du..:

Hölck, Ole ; Heuchel, Matthias ; Böhning, Martin.
Journal of Polymer Science Part B: Polymer Physics.  46 (2007)  1 - p. 59-71 , 2007
Link: https://doi.org/10.1002/..
 
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