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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
2
Reliability Performance of S-Connect Module (Bridge Technol..:
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2021 IEEE International Interconnect Technology Conference (IITC) ,
4
Cu-Cu Bonding using Optimized Copper Nitride Passivation fo..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
6
Development of CMOS-Compatible Low Temperature Cu Bonding O..:
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2019 International 3D Systems Integration Conference (3DIC) ,
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Characterization of Nitride Passivated Cu Surface for Low-T..:
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2019 International 3D Systems Integration Conference (3DIC) ,
10