Haesung Park
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2

Reliability Performance of S-Connect Module (Bridge Technol..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Jang, Heejun ; Ahn, Kyun ; Park, Haesung... - p. 1027-1031 , 2023
 
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4

Cu-Cu Bonding using Optimized Copper Nitride Passivation fo..:

, In: 2021 IEEE International Interconnect Technology Conference (IITC),
 
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5

The Relationship between Physical Exercise and Cognitive Fu..:

Koh, Youngseung ; Oh, Yeonsu ; Park, Haesung..
International Journal of Environmental Research and Public Health.  17 (2020)  23 - p. 8821 , 2020
 
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6

Development of CMOS-Compatible Low Temperature Cu Bonding O..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Park, Haesung ; Park, Manseok ; Seo, Han Kyeol. - p. 1474-1479 , 2020
 
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8

Subchronic toxicity evaluation of ethanol extract of Cassia..:

Lee, Mu-Jin ; Nho, Jong-Hyun ; Yang, Beo-Deul...
Regulatory Toxicology and Pharmacology.  109 (2019)  - p. 104487 , 2019
 
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9

Characterization of Nitride Passivated Cu Surface for Low-T..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
 
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10

Effects of Argon and Nitrogen ion Bombardments on Sputtered..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
 
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15

Contact Electrification of Individual Dielectric Microparti..:

Park, Haesung ; LeBrun, Thomas W.
ACS Applied Materials & Interfaces.  8 (2016)  50 - p. 34904-34913 , 2016
 
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