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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
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Chip-Package interaction stress analysis and optimization f..:
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2021 22nd International Conference on Electronic Packaging Technology (ICEPT) ,
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The multi-dimension co-design for the package of the high-s..:
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2015 IEEE International Conference on Mechatronics and Automation (ICMA) ,
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The latest research status and prospect on microwave techno..:
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2015 IEEE International Conference on Imaging Systems and Techniques (IST) ,
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