Heish, Kuo-Hua
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1

High-Reliability Solder Pastes For Automotive Applications ..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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2

Effects of Corner/Edge Bond and Side-fill for Automotive MC..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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10

Internal radiotherapy and dosimetric study for 111In/177Lu-..:

Wang, Hsin-Ell ; Yu, Hung-Man ; Lu, Yi-Ching...
Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment.  569 (2006)  2 - p. 533-537 , 2006
 
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