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2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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Interconnect Modelling Sensitivity Studies for High Signali..:
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2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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Far End Crosstalk Mitigation of Differential High Speed Int..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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OpenCAPI Memory Interface Simulation and Test for Different..:
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2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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RX Equalization for a High-Speed Channel based on Bayesian ..:
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2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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SI Model to Hardware Correlation on a 44 Gb/s HLGA Socket C..:
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2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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Effect and Sensitivity of Postcursor FFE in a 25 Gb/s High ..:
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2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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Signal Integrity Considerations of PCB Wiring in Tightly Pi..:
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2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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An Approach For Tuning Signal Integrity Properties Of Edge ..:
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2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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Dual-Band Monopole Antenna Feeds for Substrate Integrated W..:
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2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ,
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