E-LIB Suche - Ergebnisse für: Herrault, Florian

1

A Heterogeneously-Integrated Ka-Band, N-Polar Gallium Nitri..:

, In: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024,

Kim, Justin J. ; Hodge, Michael D. ; Soler, Mark R.... - p. 1045-1048 , 2024

Link: https://doi.org/10.1109/..

2

Heterogeneously-Integrated Gallium Nitride and Indium Phosp..:

, In: 2024 IEEE Radio Frequency Integrated Circuits Symposium (RFIC),

Kim, Justin J. ; Hodge, Michael D. ; Soler, Mark R.... - p. 27-30 , 2024

Link: https://doi.org/10.1109/..

3

Process Design Kit and Initial Demonstration of Digital Met..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Nadri, Souheil ; Tu, B-A. Clayton ; Herrault, Florian... - p. 623-628 , 2023

Link: https://doi.org/10.1109/..

4

N-Polar GaN HEMTs in a High-Uniformity 100-mm Wafer Process..:

Arias-Purdue, Andrea ; Rowell, Petra V. ; King, Casey M....
IEEE Microwave and Wireless Technology Letters. 33 (2023) 7 - p. 1011-1014 , 2023

Link: https://doi.org/10.1109/..

5

A Survey of GaN HEMT Technologies for Millimeter-Wave Low N..:

Miller, Nicholas C. ; Arias-Purdue, Andrea ; Arkun, Erdem...
IEEE Journal of Microwaves. 3 (2023) 4 - p. 1134-1146 , 2023

Link: https://doi.org/10.1109/..

6

10μm Pitch Bumping of Singulated Die Using a Temporary Meta..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Nadri, Souheil ; Clayton Tu, B-A. ; Herrault, Florian... - p. 1000-1004 , 2022

Link: https://doi.org/10.1109/..

7

Anisotropic nanolaminated CoNiFe cores integrated into micr..:

Kim, Jooncheol ; Kim, Minsoo ; Kim, Jung-Kwun..
Journal of Physics D: Applied Physics. 48 (2015) 46 - p. 462001 , 2015

Link: https://doi.org/10.1088/..

8

Sidewall lithography of micron-sized features in high-aspec..:

Ji, Chang-Hyeon ; Herrault, Florian ; Allen, Mark G
Micro and Nano Systems Letters. 2 (2014) 1 - p. , 2014

Link: https://doi.org/10.1186/..

9

Microfabrication of air core power inductors with metal-enc..:

Kim, Jungkwun ; Herrault, Florian ; Yu, Xuehong...
Journal of Micromechanics and Microengineering. 23 (2013) 3 - p. 035006 , 2013

Link: https://doi.org/10.1088/..

10

A MEMS lamination technology based on sequential multilayer..:

Kim, Minsoo ; Kim, Jooncheol ; Herrault, Florian..
Journal of Micromechanics and Microengineering. 23 (2013) 9 - p. 095011 , 2013

Link: https://doi.org/10.1088/..

11

Microfabrication of toroidal inductors integrated with nano..:

Kim, Jooncheol ; Kim, Jung-Kwun ; Kim, Minsoo..
Journal of Micromechanics and Microengineering. 23 (2013) 11 - p. 114006 , 2013

Link: https://doi.org/10.1088/..

12

Micro projection lithography using microlens on a mask:

Ji, Chang-Hyeon ; Herrault, Florian ; Allen, Mark G
Journal of Micromechanics and Microengineering. 19 (2009) 12 - p. 127003 , 2009

Link: https://doi.org/10.1088/..

13

An electromagnetic energy scavenger from direct airflow:

Kim, Seong-Hyok ; Ji, Chang-Hyeon ; Galle, Preston...
Journal of Micromechanics and Microengineering. 19 (2009) 9 - p. 094010 , 2009

Link: https://doi.org/10.1088/..

14

A metallic buried interconnect process for through-wafer in..:

Ji, Chang-Hyeon ; Herrault, Florian ; Allen, Mark G
Journal of Micromechanics and Microengineering. 18 (2008) 8 - p. 085016 , 2008

Link: https://doi.org/10.1088/..

15

High temperature operation of multi-watt, axial-flux, perma..:

Herrault, Florian ; Arnold, David P. ; Zana, Iulica..
Sensors and Actuators A: Physical. 148 (2008) 1 - p. 299-305 , 2008

Link: https://doi.org/10.1016/..