Hessler, Thierry
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Solid-liquid interdiffusion (SLID) bonding in the Au–In sys..:

Deillon, Léa ; Hessler-Wyser, Aïcha ; Hessler, Thierry.
Journal of Micromechanics and Microengineering.  25 (2015)  12 - p. 125016 , 2015
 
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