Hirano, Takaaki
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1

Novel three-layer stacking process with face-to-back CoW 6 ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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2

Elucidating the mechanism of four corner voids in chip-on-w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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4

Method to evaluate the adhesion distribution on wafers:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hiratsuka, Tatsumasa ; Hirano, Takaaki ; Kotoo, Kengo... - p. 1623-1627 , 2024
 
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9

Simulation of device structure impacts on bonding wave and ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Hirano, Takaaki ; Yamada, Taichi ; Kobayashi, Shoji.. - p. 1314-1318 , 2023
 
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12

Visual sensing and controlling of the keyhole in robotic pl..:

Wang, Weixi ; Yamane, Satoshi ; Wang, Qi...
The International Journal of Advanced Manufacturing Technology.  121 (2022)  1-2 - p. 1401-1414 , 2022
 
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13

Behavior of Bonding Strength on Wafer-to-Wafer Cu-Cu Hybrid..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Furuse, Shunsuke ; Fujii, Nobutoshi ; Kotoo, Kengo... - p. 591-594 , 2022
 
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15

Anatomical Study of the Cuboid and Its Ligamentous Attachme..:

Tazaki, Masakazu ; Hirano, Takaaki ; Akiyama, Yui...
Foot & Ankle Orthopaedics.  5 (2020)  4 - p. 247301142095965 , 2020
 
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