Ho-Chuan Lin
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1

High Speed Signal Design on Fan-Out RDL Interposer for Arti..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Zhuang, Ming-Han ; Shih, Chih-Yuan ; Lin, Ho-Chuan.. - p. 275-276 , 2024
 
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2

Optimizing Thermal Management: An Evaluation of Embedded Al..:

Lin, Ho-Chuan ; Vu, Van Hoan ; Tansyafri, Alfandy.
New Energy Exploitation and Application.  3 (2024)  1 - p. 1-8 , 2024
 
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4

High Speed SerDes Design on Flip Chip Package Substrate:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
 
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5

Machine Learning in Integrated Circuit Substrate Electrical..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lai, Jung-Pin ; Lin, Ying-Lei ; Liu, Yu-Hui... - p. 178-182 , 2023
 
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8

A comprehensive study of two interactive parallel premixed ..:

Lin, Ho-Chuan ; Cheng, Tsarng-Sheng ; Chen, Bi-Chian..
Proceedings of the Combustion Institute.  32 (2009)  1 - p. 995-1002 , 2009
 
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