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2024 International Conference on Electronics Packaging (ICEP) ,
1
High Speed Signal Design on Fan-Out RDL Interposer for Arti..:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
4
High Speed SerDes Design on Flip Chip Package Substrate:
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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
5