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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Embedded RF Packaging Via Ceramic 3D Printing and Printed E..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
Modeling and Additive Manufacturing of Inductors in Complex..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
5