Hoel, Cathleen A.
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1

Embedded RF Packaging Via Ceramic 3D Printing and Printed E..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Obeidat, Abdullah S. ; Umar, Ashraf ; Dou, Zhi... - p. 685-692 , 2024
 
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2

Modeling and Additive Manufacturing of Inductors in Complex..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Alshaibani, WT ; Umar, Ashraf ; Alshatnawi, Firas... - p. 1986-1992 , 2024
 
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5

High Temperature Die Interconnection Approaches:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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11

Evidence for Tetrahedral Zinc in Amorphous In2–2xZnxSnxO3 (..:

Hoel, Cathleen A. ; Xie, Sujing ; Benmore, Chris...
Zeitschrift für anorganische und allgemeine Chemie.  637 (2011)  7-8 - p. 885-894 , 2011
 
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15

High-Pressure Synthesis and Local Structure of Corundum-Typ..:

Hoel, Cathleen A. ; Amores, José Manuel Gallardo ; Morán, Emilio...
Journal of the American Chemical Society.  132 (2010)  46 - p. 16479-16487 , 2010
 
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