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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
9
Shear performance of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu sol..:
, In:
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
11
Tensile performance of line-type microscale Cu/Sn-58Bi/Cu j..:
, In:
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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
15