Hong, Lai Wei
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4

High Acceleration Dynamic Methodology for Board-Level Shock..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yu, Min-Cheng ; Wu, Nan-Yi ; Wang, Wu-Lung... - p. 1213-1218 , 2024
 
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5

Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Yang, Hung-Chun ; Lai, Wei-Hong ; Kao, Chin-Li.. - p. 151-152 , 2024
 
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7

Increased Apolipoprotein A1 Expression Correlates with Tumo..:

Chang, Chih-Chia ; Chang, Chia-Bin ; Chen, Chiung-Ju...
Current Issues in Molecular Biology.  46 (2024)  3 - p. 2155-2165 , 2024
 
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14

Solder Joint Reliability Comparison Under JEDEC Drop and Sy..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Shih, Meng-Kai ; Ke, Zih-Jun ; Yen, Chun-Yu.. - p. 153-154 , 2024
 
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15

Characterization of OH species in kHz air/H2O atmospheric p..:

Huang, Cheng-Liang ; Liao, Tzu-Yi ; He, Yi-Ting...
Plasma Sources Science and Technology.  33 (2024)  6 - p. 065005 , 2024
 
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