Hongjun Yu
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1

Selenium in plants: A nexus of growth, antioxidants, and ph..:

Ikram, Sufian ; Li, Yang ; Lin, Chai...
Journal of Plant Physiology.  296 (2024)  - p. 154237 , 2024
 
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2

Interfacial Fracture of Nonhomogeneous Materials with Compl..:

, In: Fracture Mechanics of Nonhomogeneous Materials,
Guo, Licheng ; Hongjun, Yu ; Linzhi, Wu - p. 207-234 , 2023
 
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3

General Model for Nonhomogeneous Materials with General Ela..:

, In: Fracture Mechanics of Nonhomogeneous Materials,
Guo, Licheng ; Hongjun, Yu ; Linzhi, Wu - p. 81-122 , 2023
 
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4

Fracture Mechanics of Nonhomogeneous Materials Based on Pie..:

, In: Fracture Mechanics of Nonhomogeneous Materials,
Guo, Licheng ; Hongjun, Yu ; Linzhi, Wu - p. 123-164 , 2023
 
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5

Thermal Fracture of Nonhomogeneous Materials with Complex I..:

, In: Fracture Mechanics of Nonhomogeneous Materials,
Guo, Licheng ; Hongjun, Yu ; Linzhi, Wu - p. 235-274 , 2023
 
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6

Exponential Models for Crack Problems in Nonhomogeneous Mat..:

, In: Fracture Mechanics of Nonhomogeneous Materials,
Guo, Licheng ; Hongjun, Yu ; Linzhi, Wu - p. 23-80 , 2023
 
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8

Fracture of Nonhomogeneous Materials with Complex Interface:

, In: Fracture Mechanics of Nonhomogeneous Materials,
Guo, Licheng ; Hongjun, Yu ; Linzhi, Wu - p. 165-206 , 2023
 
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9

Fundamental Theory of Fracture Mechanics of Nonhomogeneous ..:

, In: Fracture Mechanics of Nonhomogeneous Materials,
Guo, Licheng ; Hongjun, Yu ; Linzhi, Wu - p. 1-21 , 2023
 
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10

Research on the factors affecting warpage of the light guid..:

, In: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Jiantong, Shang ; Gang, Yang ; Yong, Song.. - p. 1-5 , 2022
 
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11

Factors Causing the Lack of PVX Layer in FPC Bonding Zone o..:

, In: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Huiying, Li ; Weixiong, Chen ; Xin, Li... - p. 1-3 , 2020
 
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12

Study on Factors Affecting Black Matrix Charging of Positiv..:

, In: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Pengcheng, Tian ; Hailin, Xue ; Hongjun, Yu... - p. 1-3 , 2020
 
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13

Research on the relationship between the rigidity of cover ..:

, In: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Yazhou, BAO ; Gang, YANG ; Yong, SONG.. - p. 1-3 , 2020
 
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15

Optimal convergence rates of Landau equation with external ..:

Tong, Yang ; Hongjun, Yu
Acta Mathematica Scientia.  29 (2009)  4 - p. 1035-1062 , 2009
 
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