Horibe, Akihiro
36  results:
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1

Scalable Advanced DBHi Chiplet Package Using Silicon Bridge..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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2

Direct Bonded Heterogeneous Integration (DBHi): Surface Bri..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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3

Next Generation Infrared (IR) Laser Debonding / Silicon Han..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Qianwen ; Belyansky, Michael ; Sulehria, Yasir... - p. 1175-1180 , 2023
 
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4

Dimensional Parameters Controlling Capillary Underfill Flow..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Marushima, Chinami ; Aoki, Toyohiro ; Nakamura, Koki... - p. 586-590 , 2022
 
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5

Super Fine Jet Underfill Dispense Technique for Robust Micr..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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6

Characterization of Non-Conductive Paste Materials (NCP) fo..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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7

ALANINE RESTRICTION CAN INHIBIT CARCINOGENESIS IN A NOVEL M..:

Yamamoto, Akinaru ; Kawashima, Atsunari ; Sassi, Nesrine...
Urologic Oncology: Seminars and Original Investigations.  42 (2024)  - p. S20 , 2024
 
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15

Phase I study of brentuximab vedotin (SGN-35) in Japanese c..:

Koga, Yuhki ; Sekimizu, Masahiro ; Iguchi, Akihiro...
International Journal of Hematology.  111 (2020)  5 - p. 711-718 , 2020
 
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