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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Scalable Advanced DBHi Chiplet Package Using Silicon Bridge..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Direct Bonded Heterogeneous Integration (DBHi): Surface Bri..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
3
Next Generation Infrared (IR) Laser Debonding / Silicon Han..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Dimensional Parameters Controlling Capillary Underfill Flow..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Super Fine Jet Underfill Dispense Technique for Robust Micr..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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