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Hou, Fengze
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1

Review of Die-Attach Materials for SiC HighTemperature Pack..:

Hou, Fengze ; Sun, Zhanxing ; Su, Meiying...
IEEE Transactions on Power Electronics.  , 2024
Link: https://doi.org/10.1109/..
 
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2

Sintering Mechanism Analysis of Cu Nanoparticles via Molecu..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Hou, Fengze ; Ge, Honglin ; Sun, Zhanxing... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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3

Design and Evaluation of a Face-Down Embedded SiC Power Mod..:

Sun, Xinnan ; Chen, Min ; Li, Bodong...
IEEE Transactions on Power Electronics.  38 (2023)  3 - p. 2799-2804 , 2023
Link: https://doi.org/10.1109/..
 
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4

Design of inductor winding structure based on non-uniform d..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Bao, Yiying ; You, Xiangan ; Zhou, Yunyan.. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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5

Selection and Characterization of Photosensitive Polyimide ..:

Gao, Rongwei ; Ma, Rui ; Li, Jun...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  2 - p. 368-374 , 2022
Link: https://doi.org/10.1109/..
 
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6

Multi-scale Equivalent Method and Warpage Simulation of Sil..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Feng, Jianyu ; Chen, Chuan ; Hou, Fengze... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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7

Case-embedded cooling for high heat flux microwave multi-ch..:

Song, Yunqian ; Fu, Rong ; Chen, Chuan...
Applied Thermal Engineering.  214 (2022)  - p. 118852 , 2022
Link: https://doi.org/10.1016/..
 
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8

Evaluation and Optimization of a Cross-Rib Micro-Channel He..:

Chen, Haiying ; Chen, Chuan ; Zhou, Yunyan...
Micromachines.  13 (2022)  1 - p. 132 , 2022
Link: https://doi.org/10.3390/..
 
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9

Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D ..:

Zhou, Minghao ; Li, Li ; Hou, Fengze..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  6 - p. 956-963 , 2022
Link: https://doi.org/10.1109/..
 
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10

Design, integration and performance analysis of a lid-integ..:

Chen, Chuan ; Hou, Fengze ; Ma, Rui...
Applied Thermal Engineering.  198 (2021)  - p. 117457 , 2021
Link: https://doi.org/10.1016/..
 
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11

Simulation and Verification of Pressure Drop in Silicon Mic..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Chen, Chuan ; Ma, Rui ; Hou, Fengze... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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12

Microchannel Thermal Management System With Two-Phase Flow ..:

Hou, Fengze ; Zhang, Hengyun ; Huang, Dezhu...
IEEE Transactions on Power Electronics.  35 (2020)  10 - p. 10592-10600 , 2020
Link: https://doi.org/10.1109/..
 
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13

Experimental evaluation of a compact two-phase cooling syst..:

Hou, Fengze ; Wang, Wenbo ; Zhang, Hengyun...
Applied Thermal Engineering.  163 (2019)  - p. 114338 , 2019
Link: https://doi.org/10.1016/..
 
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14

Compensation Method for Die Shift in Fan-Out Packaging:

, In: 2018 19th International Conference on Electronic Packaging Technology (ICEPT),
Sun, Yue ; Hou, Fengze ; Chen, Feng... - p. 1681-1686 , 2018
Link: https://doi.org/10.1109/..
 
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15

Experimental and numerical study of 3D stacked dies under f..:

Qiu, Delong ; Cao, Liqiang ; Wang, Qidong..
Microelectronics Reliability.  74 (2017)  - p. 34-43 , 2017
Link: https://doi.org/10.1016/..
 
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