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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:
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Proceedings of the 2016 CHI Conference Extended Abstracts on Human Factors in Computing Systems ,
4
BringUBus : Matching Buses to Passengers with Lower Mobi..:
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Proceedings of the 2001 Asia and South Pacific Design Automation Conference ,
14