Hsieh, Meng-Wei
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RF Devices Integrated by Fan-Out and System-In-Package Tech..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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13

Low-Frequency Noise Properties of SiGe Heterojunction Bipol..:

Hsieh, Meng-Wei ; Hsin, Yue-Ming ; Chan, Yi-Jen.
Japanese Journal of Applied Physics.  46 (2007)  9R - p. 5729 , 2007
 
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