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Hsu, Jimmy
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1

Chipset Pin Pattern Design Impact on High-Speed Channel Cha..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hsu, Jimmy ; Ho, Brian ; Ho, Chiew Yee... - p. 203-206 , 2023
Link: https://doi.org/10.1109/..
 
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2

Asymmetric Hybrid PCB Design for Cost-Effective and Perform..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chang, Aje ; Sun, Alan ; Tsang, Kaspar... - p. 233-236 , 2023
Link: https://doi.org/10.1109/..
 
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3

Printed Circuit Board (PCB) Design Electrical Characterizat..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Zan, Mengen ; Hou, Shaozheng ; Hu, Yuanming... - p. 255-258 , 2023
Link: https://doi.org/10.1109/..
 
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4

PCB Solution with Partial Plane-on-Outer-Layer (POOL) Stack..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Ren, Yinglei ; Hsu, Jimmy ; Grossman, Brett. - p. 01-03 , 2023
Link: https://doi.org/10.1109/..
 
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5

High-speed Channel Design and Correlation Between Signal In..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Ho, Brian ; Ho, Chiew Yee ; Hsu, Jimmy. - p. 298-301 , 2023
Link: https://doi.org/10.1109/..
 
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6

Printed Circuit Board (PCB) Routing optimization with an In..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Ju, Huafang ; Li, Xiang ; Hsu, Jimmy... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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7

An Innovative Customized PCB Surface Printing for Performan..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hsu, Jimmy ; Chang, Ryan ; Ye, Xiaoning.. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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8

Fast End-to-end Channel Electrical Characterization Methodo..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hsu, Jimmy ; Lee, Leo ; Hsiao, Eric... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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9

Board Design Architecture and optimization for High-power 4..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Qin, Shijuan ; Chang, Patt ; Lee, Falconee... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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10

High-speed Data Center PCB Design Challenges and Findings b..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hsu, Jimmy ; Hung, Gary ; Tseng, Jim... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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11

Insertion Loss Reduction Using Rounded Corners to Mitigate ..:

, In: 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC),
Guo, Yuandong ; Kim, DongHyun ; Liu, Yuanzhuo... - p. 735-738 , 2022
Link: https://doi.org/10.1109/..
 
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12

Robust and Accurate Measurement Methodology for High-speed ..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chou, Fred ; Wei, Alex ; Hsieh, Johnny.. - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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13

DDR Debug Methodology for Board Design Quality and System R..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Su, Thonas ; Liu, Zoe ; Hsu, Jimmy.. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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14

Enhanced System Level Channel Characterization Methodology ..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hsu, Jimmy ; Wu, Kuan-Ting ; Ho, Brian... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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15

Board Level Probe-on-Pin Power Delivery Network Characteriz..:

, In: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI),
Chang, Patt ; Li, Y.L. ; Hsu, Jimmy... - p. 542-545 , 2022
Link: https://doi.org/10.1109/..
 
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