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Hsu, Wei-You
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1

High-strength and high-conductivity nanotwinned Cu lightly ..:

Lee, Kang-Ping ; Chen, Bo-Yan ; Lin, Yi-Quan...
Materials Science and Engineering: A.  891 (2024)  - p. 145990 , 2024
Link: https://doi.org/10.1016/..
 
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2

Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hy..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Yu-An ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 399-403 , 2024
Link: https://doi.org/10.1109/..
 
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3

Characterization of Surface Activation on Nanotwinned Coppe..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lee, Rou-Jun ; He, Pin-Syuan ; Chiu, Wei-Lan... - p. 77-78 , 2024
Link: https://doi.org/10.23919..
 
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4

High toughness of nanotwinned copper lines after annealing:

Hsu, Wei-You ; Tran, Dinh-Phuc ; Li, Yu-Jin.
Materials Science and Engineering: A.  887 (2023)  - p. 145749 , 2023
Link: https://doi.org/10.1016/..
 
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5

Electroless-deposition of epitaxial (111)-oriented silver o..:

Tseng, Hsiang-Hou ; Lan, Man-Chi ; Hsu, Wei-You...
Journal of Materials Research and Technology.  27 (2023)  - p. 7957-7963 , 2023
Link: https://doi.org/10.1016/..
 
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6

Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented..:

Yu, Min-Hsun ; Ong, Jia-Juen ; Tran, Dinh-Phuc...
Applied Surface Science.  636 (2023)  - p. 157854 , 2023
Link: https://doi.org/10.1016/..
 
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7

Measurement of Thermal Stress by X-ray Nano-Diffraction in ..:

Hsu, Wei-You ; Yang, Shih-Chi ; Lin, You-Yi...
Nanomaterials.  13 (2023)  17 - p. 2448 , 2023
Link: https://doi.org/10.3390/..
 
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8

Highly Selective Electrochemical Reduction of CO2 into Meth..:

Cai, Jin ; Zhao, Qing ; Hsu, Wei-You...
Journal of the American Chemical Society.  145 (2023)  16 - p. 9136-9143 , 2023
Link: https://doi.org/10.1021/..
 
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9

High-Bonding-Strength Polyimide Films Achieved via Thermal ..:

He, Pin-Syuan ; Tran, Dinh-Phuc ; Kuo, Ting-Yu...
Nanomaterials.  13 (2023)  9 - p. 1575 , 2023
Link: https://doi.org/10.3390/..
 
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10

Distribution of elastic stress as a function of temperature..:

Hsu, Wei-You ; Tseng, I-Hsin ; Chiang, Ching-Yu..
Journal of Materials Research and Technology.  20 (2022)  - p. 2799-2808 , 2022
Link: https://doi.org/10.1016/..
 
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11

Mechanical strengthening of nanotwinned Cu films with Ag so..:

Lee, Kang-Ping ; Tran, Dinh-Phuc ; Chen, Fu-Chian...
Materials Letters.  313 (2022)  - p. 131775 , 2022
Link: https://doi.org/10.1016/..
 
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12

Effect of Electroplating Current Density on Tensile Propert..:

Fang, Chuan-Yu ; Tran, Dinh-Phuc ; Liu, Hung-Che...
Journal of The Electrochemical Society.  169 (2022)  4 - p. 042503 , 2022
Link: https://doi.org/10.1149/..
 
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13

Effect of oxidation on electromigration in 2-µm Cu redistri..:

Tseng, I-Hsin ; Hsu, Po-Ning ; Hsu, Wei-You...
Results in Physics.  31 (2021)  - p. 105048 , 2021
Link: https://doi.org/10.1016/..
 
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14

Atomic-Scale Investigation of Electromigration with Differe..:

Shen, Fang-Chun ; Huang, Chih-Yang ; Lo, Hung-Yang...
Acta Materialia.  219 (2021)  - p. 117250 , 2021
Link: https://doi.org/10.1016/..
 
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15

Effect of annealing on the toughness of 40-μm-wide nanotwin..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Hsu, Wei-You ; Li, Yu-Jin ; Tseng, I-Hsin... - p. 906-911 , 2020
Link: https://doi.org/10.1109/..
 
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