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Hsueh, Fu-Kuo
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1

Si Multi-Bridge Channel CMOS Inverter with Five Stacked Lay..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Chang, Wei-Yuan ; Luo, Guang-Li ; Chu, Chun-Lin... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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2

Corrections to "Susceptor Coupling for the Uniformity and D..:

Lee, Yao-Jen ; Hsueh, Fu-Kuo ; Current, Michael I...
IEEE Electron Device Letters.  44 (2023)  6 - p. 1015-1015 , 2023
Link: https://doi.org/10.1109/..
 
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3

Corrections to "Low-Temperature Microwave Annealing Process..:

Lee, Yao-Jen ; Cho, Ta-Chun ; Chuang, Shang-Shiun...
IEEE Transactions on Electron Devices.  70 (2023)  7 - p. 3983-3983 , 2023
Link: https://doi.org/10.1109/..
 
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4

First Demonstration of Heterogeneous IGZO/Si CFET Monolithi..:

Chang, Shu-Wei ; Lu, Tsung-Han ; Yang, Cong-Yi...
IEEE Transactions on Electron Devices.  69 (2022)  4 - p. 2101-2107 , 2022
Link: https://doi.org/10.1109/..
 
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5

Ge Single-Crystal-Island (Ge-SCI) Technique and BEOL Ge Fin..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Chung, Hao-Tung ; Shih, Bo-Jheng ; Yang, Chih-Chao... - p. 34.5.1-34.5.4 , 2021
Link: https://doi.org/10.1109/..
 
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6

CiM3D: Comparator-in-Memory Designs Using Monolithic 3-D Te..:

Ramanathan, Akshay Krishna ; Rangachar, Srivatsa Srinivasa ; Govindarajan, Hariram Thirucherai...
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits.  7 (2021)  1 - p. 79-87 , 2021
Link: https://doi.org/10.1109/..
 
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7

Effects of Forming Gas Annealing and Channel Dimensions on ..:

Sung, Po-Jung ; Su, Chun-Jung ; Lo, Shih-Hsuan...
IEEE Journal of the Electron Devices Society.  8 (2020)  - p. 474-480 , 2020
Link: https://doi.org/10.1109/..
 
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8

DC and high-frequency characteristics of trigate polycrysta..:

Chen, Bo-Yuan ; Chen, Kun-Ming ; Shiao, Yu-Shao Jerry...
Japanese Journal of Applied Physics.  58 (2019)  SB - p. SBBJ05 , 2019
Link: https://doi.org/10.7567/..
 
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9

Monolithic 3D SRAM-CIM Macro Fabricated with BEOL Gate-All-..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Hsueh, Fu-Kuo ; Lee, Chun-Ying ; Xue, Cheng-Xin... - p. 3.3.1-3.3.4 , 2019
Link: https://doi.org/10.1109/..
 
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10

A Monolithic-3D SRAM Design with Enhanced Robustness and In..:

, In: Proceedings of the International Symposium on Low Power Electronics and Design,
Srinivasa, Srivatsa ; Ramanathan, Akshay Krishna ; Li, Xueqing... - p. 1-6 , 2018
Link: https://dl.acm.org/doi/1..
 
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11

RF power FinFET transistors with a wide drain-extended fin:

Chen, Bo-Yuan ; Chen, Kun-Ming ; Chiu, Chia-Sung...
Japanese Journal of Applied Physics.  56 (2017)  4S - p. 04CR09 , 2017
Link: https://doi.org/10.7567/..
 
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12

Low-Temperature Microwave Annealing Processes for Future IC..:

Lee, Yao-Jen ; Cho, Ta-Chun ; Chuang, Shang-Shiun...
IEEE Transactions on Electron Devices.  61 (2014)  3 - p. 651-665 , 2014
Link: https://doi.org/10.1109/..
 
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13

Characterization of Ultra-Thin Ni Silicide Film by Two-Step..:

Wu, Chien-Ting ; Lee, Yao-Jen ; Hsueh, Fu-Kuo...
ECS Journal of Solid State Science and Technology.  3 (2014)  5 - p. P122-P125 , 2014
Link: https://doi.org/10.1149/..
 
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14

Susceptor Coupling for the Uniformity and Dopant Activation..:

Lee, Yao-Jen ; Hsueh, Fu-Kuo ; Current, Michael I...
IEEE Electron Device Letters.  33 (2012)  2 - p. 248-250 , 2012
Link: https://doi.org/10.1109/..
 
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15

High Tensile Stress with Minimal Dopant Diffusion by Low Te..:

Lee, Yao-Jen ; Lu, Yu-Lun ; Mu, Zheng-Chang...
Electrochemical and Solid-State Letters.  14 (2011)  5 - p. H191 , 2011
Link: https://doi.org/10.1149/..
 
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