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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bond..:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
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Reliability Study of Two-Step Plasma-Activated Copper-Coppe..:
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2023 International Conference on Electronics Packaging (ICEP) ,
7
Time Evolution Study of Two-Step Plasma-Treated Copper-Copp..:
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2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
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Plasma-Activated Cu-Cu Direct Bonding in Ambient for Die-Di..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
10
Comparative Study of Die-Attach Materials for LED Die Bondi..:
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Plasma-Activated Cu-Cu and Al-Al Direct Bonding for Electro..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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