Hu, Liangxing
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4

Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bond..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
 
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6

Reliability Study of Two-Step Plasma-Activated Copper-Coppe..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
 
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7

Time Evolution Study of Two-Step Plasma-Treated Copper-Copp..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Hu, Liangxing ; Lim, Yu Dian ; Zhao, Peng... - p. 45-46 , 2023
 
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9

Plasma-Activated Cu-Cu Direct Bonding in Ambient for Die-Di..:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Hu, Liangxing ; Lim, Yu Dian ; Zhao, Peng.. - p. 276-278 , 2022
 
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10

Comparative Study of Die-Attach Materials for LED Die Bondi..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Hu, Liangxing ; Bao, Shuyu ; Wang, Yue... - p. 447-451 , 2022
 
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12

Plasma-Activated Cu-Cu and Al-Al Direct Bonding for Electro..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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13

Two-Step Ar/N2 Plasma-Activated Al Surface for Al-Al Direct..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Hu, Liangxing ; Lim, Yu Dian ; Zhao, Peng.. - p. 324-329 , 2022
 
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15

Time-Dependent Evolution Study of Ar/N2 Plasma-Activated Cu..:

Hu, Liangxing ; Goh, Simon Chun Kiat ; Tao, Jing...
ECS Journal of Solid State Science and Technology.  10 (2021)  12 - p. 124001 , 2021
 
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