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Hu, LiuLin
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1

A Ku-Band Dual-Channel T/R MMIC Based on a 0.18-μm GaAs E/D..:

, In: 2023 IEEE MTT-S International Wireless Symposium (IWS),
Hu, Liu-lin ; Jia, Li-ning ; Lin, Qian... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

A Wideband High-Efficiency GaN MMIC Power Amplifier for Sub..:

Hu, Liulin ; Liao, Xuejie ; Zhang, Fan...
Micromachines.  13 (2022)  5 - p. 793 , 2022
Link: https://doi.org/10.3390/..
 
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3

A RF Redundant TSV Interconnection for High Resistance Si I..:

Wang, Mengcheng ; Ma, Shenglin ; Jin, Yufeng...
Micromachines.  12 (2021)  2 - p. 169 , 2021
Link: https://doi.org/10.3390/..
 
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4

A millimetre-wave GaAs monolithic multifunctional quadruple..:

Wang, Ce-Tian ; Wu, Hai-Feng ; Tong, Wei...
International Journal of Electronics Letters.  10 (2021)  2 - p. 209-218 , 2021
Link: https://doi.org/10.1080/..
 
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5

A Compact Ultra-broadband GaN MMIC T/R Front-End Module:

, In: 2020 IEEE/MTT-S International Microwave Symposium (IMS),
Lin, Qian ; Wu, Haifeng ; Chen, Yijun... - p. 1231-1234 , 2020
Link: https://doi.org/10.1109/..
 
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6

Design, Fabrication and Measurement of Micro-Bumps Array fo..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Yang, Yuchi ; Chen, Jing ; Wang, Wei... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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7

An Ultra-wideband High-Gain GaN Amplifier with 10 W Output ..:

, In: 2020 IEEE Asia-Pacific Microwave Conference (APMC),
Lin, Qian ; Wu, Haifeng ; Liu, Lin-Sheng... - p. 104-106 , 2020
Link: https://doi.org/10.1109/..
 
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8

Design, fabrication and characterization of a Q-band patch ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Sun, Yunheng ; Jin, Yufeng ; Lian, Tingting... - p. 2230-2235 , 2020
Link: https://doi.org/10.1109/..
 
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9

Design and Experimentally Verification of a Vertical Coaxia..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Wang, MengCheng ; Ma, Shenglin ; He, ShuWei... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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10

An Ultra-wideband GaAs pHEMT Distributed Power Amplifier:

, In: 2019 IEEE 4th Advanced Information Technology, Electronic and Automation Control Conference (IAEAC),
Hu, Liu-Lin ; Hu, Dan-Hui ; Wu, Hai-Feng... - p. 2144-2147 , 2019
Link: https://doi.org/10.1109/..
 
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11

An Ultra-Broadband Quadruple-Stacked CMOS Power Amplifier:

, In: 2019 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference (CSQRWC),
Lin, Qian ; Wu, Haifeng ; Zhang, Xiao-Ming... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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12

Thermal resistance analysis for a high power 3D integrated ..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Hu, Xinxin ; Zhou, Bin ; Ma, Shenglin... - p. 406-412 , 2019
Link: https://doi.org/10.1109/..
 
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13

Thermal Property Evaluation of TSV interposer Embedded Micr..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Ma, Shenglin ; Lian, Tingting ; Cai, Han.. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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14

Design, fabrication and measurement of TSV interposer integ..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Sun, Yunheng ; Jin, Yufeng ; Cai, Han... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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15

A 7.0–8.0 GHz High Efficiency Medium Power Amplifier Design..:

, In: 2019 IEEE 4th Advanced Information Technology, Electronic and Automation Control Conference (IAEAC),
Lin, Qian ; Chen, Si-Wei ; Wu, Hai-Feng... - p. 2140-2143 , 2019
Link: https://doi.org/10.1109/..
 
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