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Huang, Andrew Yi-Ann
355  results:
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1

Wafer Defect Pattern Classification with Explainable-Decisi..:

, In: 2022 IEEE International Test Conference (ITC),
Cheng, Ken Chau-Cheung ; Li, Katherine Shu-Min ; Wang, Sying-Jyan... - p. 549-553 , 2022
Link: https://doi.org/10.1109/..
 
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2

Wafer Defect Pattern Labeling and Recognition Using Semi-Su..:

Li, Katherine Shu-Min ; Jiang, Xu-Hao ; Chen, Leon Li-Yang...
IEEE Transactions on Semiconductor Manufacturing.  35 (2022)  2 - p. 291-299 , 2022
Link: https://doi.org/10.1109/..
 
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3

Wafer Scratch Pattern Reconstruction for High Diagnosis Acc..:

Li, Katherine Shu-Min ; Chen, Leon Li-Yang ; Liao, Peter Yi-Yu...
IEEE Transactions on Semiconductor Manufacturing.  35 (2022)  2 - p. 272-281 , 2022
Link: https://doi.org/10.1109/..
 
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4

TestDNA-E: Wafer Defect Signature for Pattern Recognition b..:

Li, Katherine Shu-Min ; Chen, Leon Li-Yang ; Cheng, Ken Chau-Cheung...
IEEE Transactions on Semiconductor Manufacturing.  35 (2022)  2 - p. 372-374 , 2022
Link: https://doi.org/10.1109/..
 
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5

Integrated Scratch Marker for Wafer Defect Diagnosis:

, In: 2021 IEEE International Test Conference in Asia (ITC-Asia),
Li, Katherine Shu-Min ; Chen, Leon Li-Yang ; Liao, Peter Yi-Yu... - p. 1-4 , 2021
Link: https://doi.org/10.1109/..
 
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6

PWS: Potential Wafermap Scratch Defect Pattern Recognition ..:

, In: 2020 IEEE European Test Symposium (ETS),
Li, Katherine Shu-Min ; Liao, Peter Yi-Yu ; Chou, Leon... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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7

Wafer-level test path pattern recognition and test characte..:

, In: Proceedings of the 23rd Conference on Design, Automation and Test in Europe,
Cheng, Ken Chau-Cheung ; Li, Katherine Shu-Min ; Huang, Andrew Yi-Ann... - p. 1710-1711 , 2020
Link: https://dl.acm.org/doi/1..
 
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8

Wafer-Level Test Path Pattern Recognition and Test Characte..:

, In: 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE),
Cheng, Ken Chau-Cheung ; Shu-Min Li, Katherine ; Huang, Andrew Yi-Ann... - p. 1710-1711 , 2020
Link: https://doi.org/10.23919..
 
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9

TestDNA-E: Wafer Defect Signature for Pattern Recognition b..:

, In: 2020 IEEE International Test Conference (ITC),
Chen, Leon Li-Yang ; Li, Katherine Shu-Min ; Cheng, Ken Chau-Cheung... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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10

TestDNA: Novel Wafer Defect Signature for Diagnosis and Pat..:

Li, Katherine Shu-Min ; Tsai, Nova Cheng-Yen ; Cheng, Ken Chau-Cheung...
IEEE Transactions on Semiconductor Manufacturing.  33 (2020)  3 - p. 383-390 , 2020
Link: https://doi.org/10.1109/..
 
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11

TestDNA: Novel Wafer Defect Signature for Diagnosis and Yie..:

, In: 2019 IEEE International Test Conference (ITC),
Huang, Andrew Yi-Ann ; Li, Katherine Shu-Min ; Tsai, Cheng-Yen... - p. 1-6 , 2019
Link: https://doi.org/10.1109/..
 
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12

Years lived with disability (YLDs) for 1160 sequelae of 289..:

Vos, Theo ; Flaxman, Abraham D ; Naghavi, Mohsen...
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC6350784/.  , 2012
Link: http://www.ncbi.nlm.nih...
 
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13

Contributors:

, In: Biomedical Information Technology,
Akbilgic, Oguz ; AlAnzi, Turki ; An, Xiangdong... - p. xiii-xviii , 2020
Link: https://doi.org/10.1016/..
 
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14

Erratum to: Guidelines for the use and interpretation of as..:

Tan, Yee-Joo ; Zeng, Qi ; Bagniewska-Zadworna, Agnieszka...
info:eu-repo/semantics/altIdentifier/wos/000373982600022.  , 2018
Link: https://publikationen.bi..
 
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15

List of contributors:

, In: Translational Radiation Oncology,
Aaron, Daniel ; Abrams, Ross A. ; Agarwal, Mohit S.... - p. xi-xvi , 2023
Link: https://doi.org/10.1016/..
 
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