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2024 International Conference on Electronics Packaging (ICEP) ,
1
Mold Flow Strategy Improvement for Power Module:
, In:
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
4
Thermal Characterization of 2.5D FCBGA for GPU Application:
, In:
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2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
5