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Huang, Chen-yu
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1

O-271 THE ASSOCIATION BETWEEN A HEALTHY LIFESTYLE AND MENTA..:

Lin, Yen-Wei ; Huang, Chen-Yu ; Lin, Chih-Hao..
Occupational Medicine.  74 (2024)  Supplement_1 - p. 0-0 , 2024
Link: https://doi.org/10.1093/..
 
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2

O-085 VALIDATING AND UTILIZING A MEDITERRANEAN-DIET-BASED L..:

Lin, Yen-Wei ; Huang, Chen-Yu ; Lin, Chih-Hao...
Occupational Medicine.  74 (2024)  Supplement_1 - p. 0-0 , 2024
Link: https://doi.org/10.1093/..
 
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3

Effects of SGLT2 Inhibitors with and without Metformin in H..:

Huang, Chen-Yu ; Lee, Jen-Kuang
Journal of Clinical Medicine.  13 (2024)  5 - p. 1387 , 2024
Link: https://doi.org/10.3390/..
 
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4

Interconnect Reliability in Advanced Memory Device Packagin 

Springer Series in Reliability Engineering
Gan, Chong Leong ; Huang, Chen-Yu - 1st ed. 2023 . , 2023
Link: https://doi.org/10.1007/..
 
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5

Flip Chip Process Enablement in IC Memory Stacked Die Packa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huang, Chen-Yu ; Chiang, Tsung-Han ; Lee, Jungbae... - p. 283-288 , 2023
Link: https://doi.org/10.1109/..
 
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6

Wearout Reliability-Based Characterization in Memory Packag..:

, In: Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging,
Gan, Chong Leong, ; Huang, Chen-Yu, - p. 21-44 , 2023
Link: https://doi.org/10.1007/..
 
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7

Prediction of microdissection testicular sperm extraction o..:

Tsai, Shi-Jie ; Li, Li-Hua ; Chen, Wei-Jen...
Journal of Assisted Reproduction and Genetics.  40 (2023)  8 - p. 2013-2020 , 2023
Link: https://doi.org/10.1007/..
 
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8

Thin Die Flip Chip Process Enablement for Stacked IC Memory..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Huang, Chen-Yu ; Lee, Jungbae ; Chiang, Tsung-Han... - p. 51-52 , 2023
Link: https://doi.org/10.23919..
 
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9

Second Level Interconnect Reliability of Low Temperature So..:

, In: Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging,
Gan, Chong Leong, ; Huang, Chen-Yu, - p. 95-117 , 2023
Link: https://doi.org/10.1007/..
 
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10

Technological sustainable materials and enabling in semicon..:

Gan, Chong Leong ; Chung, Min-Hua ; Zou, Yung-Sheng..
e-Prime - Advances in Electrical Engineering, Electronics and Energy.  5 (2023)  - p. 100245 , 2023
Link: https://doi.org/10.1016/..
 
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11

Post-exercise left atrial conduit strain predicted hemodyna..:

Cheng, Jen-Fang ; Huang, Pang-Shuo ; Chen, Zheng-Wei...
European Radiology.  34 (2023)  3 - p. 1825-1835 , 2023
Link: https://doi.org/10.1007/..
 
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12

Reliability Simulation and Modeling in Memory Packaging:

, In: Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging,
Gan, Chong Leong, ; Huang, Chen-Yu, - p. 153-184 , 2023
Link: https://doi.org/10.1007/..
 
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13

Advanced Flip Chip Packaging:

, In: Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging,
Gan, Chong Leong, ; Huang, Chen-Yu, - p. 67-94 , 2023
Link: https://doi.org/10.1007/..
 
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14

Structural and biochemical insights into a hyperthermostabl..:

Chiu, Yi-Chih ; Hsu, Ting-Syuan ; Huang, Chen-Yu.
International Journal of Biological Macromolecules.  188 (2021)  - p. 914-923 , 2021
Link: https://doi.org/10.1016/..
 
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15

Tamm Plasmon‐Polariton Ultraviolet Lasers:

Xu, Wen-Hui ; Chou, Yu-Hsun ; Yang, Zih-Ying...
Advanced Photonics Research.  3 (2021)  1 - p. , 2021
Link: https://doi.org/10.1002/..
 
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