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Huang, Chih Yi
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1

High Speed D2D Interface Applied on Advanced Package:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wang, Chen Chao ; Huang, Chih Yi ; Kuo, Hung Chun... - p. 269-270 , 2024
Link: https://doi.org/10.23919..
 
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2

Electrical Performance Analysis for Bridge Die Package Solu..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Pan, Po Chih ; Chu, Fu Cheng ; Kuo, Hung Chun... - p. 113-114 , 2022
Link: https://doi.org/10.23919..
 
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3

High Density IO Fan-out Design Optimization with Signal Int..:

, In: 2019 IEEE CPMT Symposium Japan (ICSJ),
Chang, Keng Tuan ; Huang, Chih Yi ; Kuo, Hung Chun... - p. 217-221 , 2019
Link: https://doi.org/10.1109/..
 
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4

Using A Digital Twin for Verification of Automatic Fulfillm..:

, In: NOMS 2024-2024 IEEE Network Operations and Management Symposium,
Huang, Chia-Lun ; Chen, Jyh-Yuan ; Huang, Yi Chih - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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5

Assessing post-COVID-19 respiratory dynamics: a comprehensi..:

Huang, Chun-Yao ; Wu, Yao-Kuang ; Yang, Mei-Chen...
ERJ Open Research.  , 2024
Link: https://doi.org/10.1183/..
 
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6

Integrated Design Ecosystem for Chiplets Heterogeneous Inte..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Wang, Chen-Chao ; Huang, Chih-Yi. - p. 1048-1053 , 2024
Link: https://doi.org/10.1109/..
 
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7

Creative Design and Structure Applied to Chiplets Packaging:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chen-Chao ; Huang, Chih-Yi ; Kuo, Hung-Chun... - p. 1353-1358 , 2023
Link: https://doi.org/10.1109/..
 
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8

Deep Learning based Refinement for Package Substrate Routin:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huang, Peng-Tai ; Koyama, Tsubasa ; Chang, Keng-Tuan... - p. 1871-1874 , 2023
Link: https://doi.org/10.1109/..
 
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9

A real-world study of Afatinib plus ramucirumab in treatmen..:

Huang, Chun-Yao ; Huang, Hui-Li ; Lan, Chou-Chin..
BMC Cancer.  23 (2023)  1 - p. , 2023
Link: https://doi.org/10.1186/..
 
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10

Advanced Packaging Design Platform for Chiplets and Heterog..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Wang, Chen-Chao ; Huang, Chih-Yi. - p. 1032-1037 , 2023
Link: https://doi.org/10.1109/..
 
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11

Semiconductor Package Design Flow and Platform Applied on F..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lin, Youle ; Chang, Keng-Tuan ; Kuo, Hung-Chun.. - p. 21-22 , 2023
Link: https://doi.org/10.23919..
 
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12

Advanced Fanout Packaging Technology for Hybrid Substrate I..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Lee, Teck Chong ; Chen, Rick... - p. 1362-1370 , 2022
Link: https://doi.org/10.1109/..
 
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13

Co-existing obstructive sleep apnea reduces Nuss surgery ef..:

Huang, Yi-Chih ; Cheng, Yeung-Leung ; Su, Wen-Lin...
PLOS ONE.  17 (2022)  11 - p. e0277494 , 2022
Link: https://doi.org/10.1371/..
 
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14

Ultra High Density Package Design and Electrical Analysis i..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Hsieh, Tsun-Lung ; Kuo, Hung-Chun ; Jhong, Ming-Fong.. - p. 457-460 , 2019
Link: https://doi.org/10.1109/..
 
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15

Looping tracks associated with tropical cyclones approachin..:

Huang, Yi-Chih ; Lin, Yuh-Lang
Meteorology and Atmospheric Physics.  130 (2017)  3 - p. 333-348 , 2017
Link: https://doi.org/10.1007/..
 
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