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Huang, Haimeng
158  results:
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1

Depth Feature Matching Based Coherence Registration of 3D B..:

, In: 2024 3rd International Conference on Image Processing and Media Computing (ICIPMC),
Li, Yuanyuan ; Huang, Haimeng ; Wu, Jun... - p. 88-92 , 2024
Link: https://doi.org/10.1109/..
 
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2

A novel field plate with arcuate end for improving GaN HEMT:

Cheng, Junji ; Liu, Jiaping ; Luo, Yuanjie...
Electronics Letters.  60 (2024)  12 - p. , 2024
Link: https://doi.org/10.1049/..
 
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3

Fabricating and TCAD Optimization for a SiC Trench MOSFET W..:

Yi, Bo ; Li, Huan ; Zhang, Bingke...
IEEE Transactions on Electron Devices.  71 (2024)  3 - p. 1618-1625 , 2024
Link: https://doi.org/10.1109/..
 
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4

A Semi-automatic Interactive Registration Software for 3D B..:

, In: 2024 3rd International Conference on Image Processing and Media Computing (ICIPMC),
Li, Yuanyuan ; Liu, Chao ; Wu, Jun... - p. 239-244 , 2024
Link: https://doi.org/10.1109/..
 
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5

Study on a p-GaN HEMT with composite passivation and compos..:

Cheng, Junji ; Wang, Queyang ; Liu, Yikai...
Semiconductor Science and Technology.  39 (2024)  8 - p. 085004 , 2024
Link: https://doi.org/10.1088/..
 
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6

Dense Correspondence Learning between Key Points in 3D C.el..:

, In: 2024 3rd International Conference on Image Processing and Media Computing (ICIPMC),
Li, Yuanyuan ; Yang, Bo ; Wu, Jun... - p. 70-74 , 2024
Link: https://doi.org/10.1109/..
 
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7

The preparation of a suspension of microencapsulated phase ..:

Jin, Weizhun ; Huang, Qinghua ; Huang, Haimeng...
Journal of Energy Storage.  73 (2023)  - p. 108868 , 2023
Link: https://doi.org/10.1016/..
 
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8

Temperature Dependent Optimization for Specific On-Resistan..:

, In: 2023 IEEE 15th International Conference on ASIC (ASICON),
Zhang, Zonghao ; Wang, Xi ; Ma, Keqiang... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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9

Comprehensive Comparison of Temperature Performances for Si..:

, In: 2023 IEEE 15th International Conference on ASIC (ASICON),
Yi, Bo ; Huang, HaiMeng ; Hu, HaoRan... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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10

A Novel Junction Termination Technique with Excellent Cost-..:

, In: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Cheng, Junji ; Meng, Weisen ; Yi, Bo... - p. 183-186 , 2023
Link: https://doi.org/10.1109/..
 
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11

Investigation of a Novel Enhancement-Mode Al0.25Ga0.75N/AlN..:

Yi, Bo ; Xu, Yi ; Cheng, Junji...
IEEE Transactions on Electron Devices.  70 (2023)  7 - p. 3704-3710 , 2023
Link: https://doi.org/10.1109/..
 
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12

Modeling and simulation of an insulated-gate HEMT using p-S..:

Yi, Bo ; Xu, Yi ; Zheng, LiTian...
Microelectronics Journal.  139 (2023)  - p. 105895 , 2023
Link: https://doi.org/10.1016/..
 
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13

A Novel Lateral Power MOSFET with Ultra-low Energy Consumpt..:

, In: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Cheng, Junji ; Zhong, Tao ; Yi, Bo... - p. 282-285 , 2023
Link: https://doi.org/10.1109/..
 
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14

Analytical model and simulation study of a novel enhancemen..:

Yi, Bo ; Zhang, Song ; Zhang, ZhiNing...
Semiconductor Science and Technology.  38 (2023)  9 - p. 095003 , 2023
Link: https://doi.org/10.1088/..
 
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15

Highly permeable and durable mixed-matrix reverse osmosis m..:

Huang, Haimeng ; Wang, Xiaoying ; Deng, Yanan.
Desalination.  551 (2023)  - p. 116412 , 2023
Link: https://doi.org/10.1016/..
 
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