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Huang, Hung-Hsien
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1

Mold Flow Strategy Improvement for Power Module:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Huang, Bing-Yuan ; Lu, Ying-Xu ; Huang, Hung-Hsien.. - p. 167-168 , 2024
Link: https://doi.org/10.23919..
 
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2

Innovative Two-Phase Immersion Cooling Solutions for high-p..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sharma, Sumit ; Ahmad, Aqbal ; Huang, ICheng... - p. 1515-1515 , 2024
Link: https://doi.org/10.1109/..
 
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3

Effect of Flip-Chip Ball Grid Array Structure on Capillary ..:

Hung, Hao-Hsi ; Cheng, Yu-Chi ; Hwang, Sheng-Jye...
Results in Engineering.  , 2024
Link: https://doi.org/10.1016/..
 
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4

Enhanced Heat Spreading Performance of Printed Circuit Boar..:

Yu, Jui-Cheng ; Liao, Chien-Neng ; Chang, Yu-Hsiang...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  2 - p. 221-228 , 2024
Link: https://doi.org/10.1109/..
 
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5

Improved Compact Thermal Model for Over-Molded Packages:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Tseng, Lev ; Chang, Yu- Hsiang ; Huang, Bo-Yu... - p. 187-190 , 2023
Link: https://doi.org/10.1109/..
 
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6

Creative Design and Structure Applied to Chiplets Packaging:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chen-Chao ; Huang, Chih-Yi ; Kuo, Hung-Chun... - p. 1353-1358 , 2023
Link: https://doi.org/10.1109/..
 
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7

High-performance electrodeposited copper wicks for heat-spr..:

Yu, Jui-Cheng ; Chien, Heng-Chieh ; Chiang, Chao-Yang...
Applied Thermal Engineering.  228 (2023)  - p. 120495 , 2023
Link: https://doi.org/10.1016/..
 
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8

Mechanical and Thermal Characterization Analysis of Chip-la..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Yin, Wei-Jie ; Lai, Wei-Hong ; Lu, Ying-Xu... - p. 1711-1719 , 2022
Link: https://doi.org/10.1109/..
 
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9

Development of Ultra-Thin Thermal Ground Plane with High Pe..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Hu, Ian ; Huang, Hung-Hsien ; Huang, Po-Cheng... - p. 97-103 , 2020
Link: https://doi.org/10.1109/..
 
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10

Transverse thermoelectric effect of asymmetrically doped Bi..:

Huang, Hung-Hsien ; Lu, Meng-Pei ; Liao, Chien-Neng
Journal of Applied Physics.  119 (2016)  20 - p. , 2016
Link: https://doi.org/10.1063/..
 
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11

Enhanced Seebeck coefficient of bismuth telluride compounds..:

Huang, Hung-Hsien ; Lu, Meng-Pei ; Chiu, Chien-Hao...
Applied Physics Letters.  103 (2013)  16 - p. , 2013
Link: https://doi.org/10.1063/..
 
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12

Cell-type specificity of lung cancer associated with low-do..:

Huang, Hsien-Hung ; Huang, Jing-Yang ; Lung, Chia-Chi...
BMC Public Health.  13 (2013)  1 - p. , 2013
Link: https://doi.org/10.1186/..
 
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13

Construction of core-shell TiNb2O7/Li4Ti5O12 composites wit..:

Hsiao, Yu-Sheng ; Weng, Lin-Yang ; Cheng, Ta-Hung...
Journal of Energy Storage.  77 (2024)  - p. 109860 , 2024
Link: https://doi.org/10.1016/..
 
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14

Advancing Li3VO4 as a high-performance anode material for u..:

Hsiao, Yu-Sheng ; Huang, Jen-Hsien ; Weng, Lin-Yang...
Chemical Engineering Journal.  489 (2024)  - p. 150973 , 2024
Link: https://doi.org/10.1016/..
 
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15

Defect-rich high-entropy spinel oxide catalyst for efficien..:

Xiao, Xun-Hong ; Kabtamu, Daniel Manaye ; Demeku, Aknachew Mebreku...
Journal of Power Sources.  597 (2024)  - p. 234178 , 2024
Link: https://doi.org/10.1016/..
 
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