Huang, Jeng-Hau
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3

Low-Temperature and Pressureless Cu-to-Cu Bonding by Electr..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Shih, Po-Shao ; Huang, Jeng-Hau ; Shen, Chang-Hsien... - p. 579-584 , 2023
 
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4

A novel and simple method of low temperature, low process t..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huang, Jeng-Hau ; Shih, Po-Shao ; Shen, Chang-Hsien... - p. 1660-1663 , 2023
 
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5

Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Mic..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lin, Yung-Sheng ; Hung, Yun-Ching ; Kao, Chin-Li... - p. 177-181 , 2022
 
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6

Impact of Source/Drain Tie on a 30 nm Bottom Gate MOSFETs:

, In: 2007 IEEE Conference on Electron Devices and Solid-State Circuits,
Lin, Jyi-Tsong ; Lin, Jeng-Da ; Shiang-Shi, Kang... - p. None , 2007
 
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7

Complement C1q mediates the expansion of periportal hepatic..:

Ho, Tung-Ching ; Wang, Er-Yea ; Yeh, Kun-Huei...
Proceedings of the National Academy of Sciences of the United States of America.  117 (2020)  12 - p. 6717-6725 , 2020
 
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8

Complement C1q mediates the expansion of periportal hepatic..:

Ho, Tung-Ching ; Wang, Er-Yea ; Yeh, Kun-Huei...
Proceedings of the National Academy of Sciences.  117 (2020)  12 - p. 6717-6725 , 2020
 
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10

Reversibility of image with balanced fidelity and capacity ..:

Hsu, Fu-Hau ; Wu, Min-Hao ; Wang, Shiuh-Jeng.
The Journal of Supercomputing.  66 (2013)  2 - p. 812-828 , 2013
 
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12

Inorganic material for high speed write-once FVD disc:

Wu, Ting-Hau ; Chen, Jung-Po ; Wu, Chih-Yuan...
Journal of Magnetism and Magnetic Materials.  304 (2006)  1 - p. e359-e361 , 2006
 
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