Hueting, Raymond J. E.
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1

Opportunities and Challenges of Pressure Contact Packaging ..:

Wang, Lei ; Wang, Wenbo ; Zeng, Keqiu...
IEEE Transactions on Power Electronics.  39 (2024)  2 - p. 2401-2419 , 2024
 
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2

Development of Pressure Contact Technology for Multi-chip S..:

, In: 2024 IEEE Applied Power Electronics Conference and Exposition (APEC),
Wang, Lei ; Wang, Wenbo ; Rietveld, Gert.. - p. 202-209 , 2024
 
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3

Review of Topside Interconnections for Wide Bandgap Power S..:

Wang, Lisheng ; Wang, Wenbo ; Hueting, Raymond J. E...
IEEE Transactions on Power Electronics.  38 (2023)  1 - p. 472-490 , 2023
 
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4

A new SiC power module assembly based on silver sintering b..:

, In: 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe),
Wang, Lisheng ; Lei, Zhouqiao ; Liang, Ruizhi.. - p. 1-8 , 2023
 
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6

Electrostatic Doping and Devices:

, In: Springer Handbook of Semiconductor Devices; Springer Handbooks,
Hueting, Raymond J. E. ; Gupta, Gaurav - p. 371-389 , 2022
 
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12

InAs Electron-Hole Bilayer LED:

, In: 2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS),
 
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