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2024 IEEE Applied Power Electronics Conference and Exposition (APEC) ,
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Development of Pressure Contact Technology for Multi-chip S..:
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2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) ,
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A new SiC power module assembly based on silver sintering b..:
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Springer Handbook of Semiconductor Devices; Springer Handbooks ,
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Electrostatic Doping and Devices:
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2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) ,
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