Huitink, David R.
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1

A Partial Discharge Inception Voltage Modeling Approach:

Mukherjee, Shilpi ; Evans, Tristan M. ; Huitink, David R..
IEEE Open Journal of Power Electronics.  4 (2023)  - p. 148-160 , 2023
 
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2

Electromigration-Aware Reliability Optimization of MCPM Lay..:

, In: 2022 IEEE Energy Conversion Congress and Exposition (ECCE),
 
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Laminated transient liquid phase preform and bond character..:

Okafor, Ekene Gabriel ; Harris, John ; Marshall, Larry.
Journal of Materials Science: Materials in Electronics.  34 (2023)  10 - p. , 2023
 
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9

Toward Direct Cooling in High Voltage Power Electronics: Di..:

Iradukunda, Ange-Christian ; Nafis, Bakhtiyar M. ; Huitink, David...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  5 - p. 784-794 , 2024
 
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10

Multidevice Dual Active Half Bridge DC-DC Converter with Ze..:

, In: 2023 IEEE Transportation Electrification Conference & Expo (ITEC),
 
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11

Fabrication Process Optimization of A High- Power Double-Si..:

, In: 2023 IEEE Energy Conversion Congress and Exposition (ECCE),
Chen, Yuxiang ; Du, Liayng ; Du, Xia... - p. 5900-5905 , 2023
 
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12

Electrothermal System Design and Evaluation of Low EMI and ..:

Whitt, Reece ; Yuan, Zhao ; Emon, Asif Imran..
IEEE Transactions on Power Electronics.  38 (2023)  1 - p. 538-547 , 2023
 
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13

Phase Transition Behavior of Thin Film Phase Change Materia..:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
 
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14

Factoring Interacting Stress Mechanisms in Design for Relia..:

Huitink, David ; Vinson, Whit ; Ruby, Collin...
Journal of Microelectronics and Electronic Packaging.  20 (2023)  4 - p. , 2023
 
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15

Synthesis of nano-size paraffin/silica-based encapsulated p..:

Ghufran, Muhammad ; Huitink, David
Journal of Materials Science.  58 (2023)  18 - p. 7673-7689 , 2023
 
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