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Hung, Liang-Yih
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1

Underfill Selection Guideline for Fan-Out Heterogeneous Int..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Teng, Wen-Yu ; Hung, Liang-Yih ; Lee, Jackson... - p. 1993-1997 , 2024
Link: https://doi.org/10.1109/..
 
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2

Advanced TIM Material Analysis for High Performance Package..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Jhan, Jyun-De ; Teng, Wen-Yu ; Hung, Liang-Yih.. - p. 229-230 , 2024
Link: https://doi.org/10.23919..
 
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3

High Thermal EMC Solution Applied in Thin FCCSP:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Su, Pin-Jing ; Wang, Jerry ; Hung, Liang-Yih.. - p. 584-587 , 2023
Link: https://doi.org/10.1109/..
 
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4

Interfacial Microstructure Evolution of Low Melting Point A..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chen, Cheng-Lun ; Hung, Liang-Yih ; Lee, Yueh Yang.. - p. 102-105 , 2023
Link: https://doi.org/10.1109/..
 
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5

Stress and Reliability of Underfills in Heterogeneous Integ..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Teng, Wen-Yu ; Lee, Jackson ; Hung, Liang-Yih.. - p. 235-236 , 2023
Link: https://doi.org/10.23919..
 
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6

High Thermal Graphite TIM Solution Applied to Fan-Out Platf..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Su, Pin-Jing ; Lin, Dan ; Lin, Shane... - p. 1224-1227 , 2022
Link: https://doi.org/10.1109/..
 
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7

Interfacial Microstructure Evolution of Indium Jointed with..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chen, Cheng-Lun ; Hung, Liang-Yih ; Lee, Yueh Yang. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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8

Interfacial reactions between pure indium solder and Au/Ni ..:

Huang, Li-Chi ; Zhang, Yan-Ping ; Chen, Chih-Ming..
Journal of Materials Science: Materials in Electronics.  33 (2022)  16 - p. 13143-13151 , 2022
Link: https://doi.org/10.1007/..
 
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9

Intermetallic compound formation and growth behavior at the..:

Huang, Li-Chi ; Zhang, Yan-Ping ; Chen, Chih-Ming..
Materials Characterization.  184 (2022)  - p. 111673 , 2022
Link: https://doi.org/10.1016/..
 
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10

Stress and Reliability Challenges of Underfills in Large-Si..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Teng, Wen-Yu ; Lee, Jackson ; Tseng, Hsin-Ming... - p. 225-226 , 2022
Link: https://doi.org/10.23919..
 
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11

Effect of Underfill Additive Agents on Crack Prevention in ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chen, Ching-Chia ; Teng, Wen-Yu ; Tsai, Fang Lin... - p. 477-480 , 2022
Link: https://doi.org/10.1109/..
 
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12

3DIC Stacking Process Investigation by Soldering Bonding Te..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Li, Jay ; Jhen Chen, Wei ; Lin, Joe... - p. 1121-1125 , 2022
Link: https://doi.org/10.1109/..
 
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13

Anomalous temperature dependence of photoluminescence lifet..:

Lee, Wei Ni ; Lai, Lai-Hung ; Tu, Yi-Qi...
Materials Today Physics.  41 (2024)  - p. 101339 , 2024
Link: https://doi.org/10.1016/..
 
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14

Identification of the physical origin behind disorder, hete..:

Berhe, Taame Abraha ; Cheng, Ju-Hsiang ; Su, Wei-Nien...
J. Mater. Chem. A.  5 (2017)  39 - p. 21002-21015 , 2017
Link: https://doi.org/10.1039/..
 
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15

Facile Synthesis of [101]-Oriented Rutile TiO2 Nanorod Arra..:

Sutiono, Hogiartha ; Tripathi, Alok M. ; Chen, Hung-Ming...
ACS Sustainable Chemistry & Engineering.  4 (2016)  11 - p. 5963-5971 , 2016
Link: https://doi.org/10.1021/..
 
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