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2023 IEEE 12th Global Conference on Consumer Electronics (GCCE) ,
1
Efficient Max Pooling Architecture with Zero-Padding for Co..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
4
Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
8
A Novel Polymer-Based Ultra-High Density Bonding Interconne..:
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ICASSP 2021 - 2021 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) ,
14