E-LIB Suche - Ergebnisse für: Hung, Tzu-Kuan

1

Quantitative Comparison of Point Cloud Compression Algorith..:

Wu, Cheng-Hao ; Hsu, Chih-Fan ; Hung, Tzu-Kuan...
IEEE Transactions on Multimedia. 25 (2023) - p. 3073-3088 , 2023

Link: https://doi.org/10.1109/..

2

Error Concealment of Dynamic 3D Point Cloud Streaming:

, In: Proceedings of the 30th ACM International Conference on Multimedia,

Hung, Tzu-Kuan ; Huang, I-Chun ; Cox, Samuel Rhys.. - p. 3134-3142 , 2022

Link: https://dl.acm.org/doi/1..

3

Comparison of Different Copper Nitride Passivation Layers F..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Wang, Chiao-Yen ; Hung, Tzu-Heng ; Liu, Ping-Jung. - p. 2157-2162 , 2024

Link: https://doi.org/10.1109/..

4

A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by ..:

Huang, Yuan-Chiu ; Lin, Yu-Xian ; Hsiung, Chien-Kang...
IEEE Electron Device Letters. 45 (2024) 3 - p. 452-455 , 2024

Link: https://doi.org/10.1109/..

5

Stress Issue of Vertical Connections in 3D Integration for ..:

Hung, Tzu-Heng ; Pan, Yu-Ming ; Chen, Kuan-Neng
Memories - Materials, Devices, Circuits and Systems. 4 (2023) - p. 100024 , 2023

Link: https://doi.org/10.1016/..

6

A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Us..:

Hung, Tzu-Heng ; Liu, Ping-Jung ; Wang, Chiao-Yen..
IEEE Journal of the Electron Devices Society. 11 (2023) - p. 473-479 , 2023

Link: https://doi.org/10.1109/..

7

TSV Integration With Chip Level TSV-to-Pad Cu/SiO₂ Hybrid B..:

Hung, Tzu-Heng ; Lo, James Yi-Jen ; Kuo, Tzu-Ying...
IEEE Electron Device Letters. 44 (2023) 7 - p. 1176-1179 , 2023

Link: https://doi.org/10.1109/..

8

Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid..:

Huang, Yuan-Chiu ; Lin, Yu-Xian ; Hsiung, Chien-Kang..
Nanomaterials. 13 (2023) 17 - p. 2490 , 2023

Link: https://doi.org/10.3390/..

9

Direct metal bonding using nanotwinned Ag films with (1 1 1..:

Chang, Leh-Ping ; Wang, Jian-Jie ; Hung, Tzu-Heng..
Applied Surface Science. 576 (2022) - p. 151845 , 2022

Link: https://doi.org/10.1016/..

10

Surface Condition Optimization for Low Temperature Oxide Bo..:

, In: 2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT),

Hung, Tzu-Heng ; Chen, Kuan-Neng - p. 1-1 , 2022

Link: https://doi.org/10.1109/..

11

Duckiepond: An Open Education and Research Environment for ..:

, In: 2019 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS),

Lin, Ni-Ching ; Benjamin, Michael ; Chen, Chi-Fang... - p. 7219-7226 , 2019

Link: https://doi.org/10.1109/..

12

Low temperature growth of carbon nanotubes using chemical b..:

Chuang, Tzu-Kuan ; Anuratha, K.S. ; Lin, Jeng-Yu...
Surface and Coatings Technology. 344 (2018) - p. 534-540 , 2018

Link: https://doi.org/10.1016/..

13

Deep Trail-Following Robotic Guide Dog in Pedestrian Enviro..:

, In: 2018 IEEE International Conference on Robotics and Automation (ICRA),

Chuang, Tzu-Kuan ; Wang, Hsueh-Cheng ; Lin, Ni-Ching... - p. 5849-5855 , 2018

Link: https://doi.org/10.1109/..

14

Threshold voltage controlled by gate area and gate recess i..:

Yeh, Po-Chun ; Lin, Yun-Wei ; Huang, Yue-Lin...
Applied Physics Express. 8 (2015) 8 - p. 084101 , 2015

Link: https://doi.org/10.7567/..

15

Simulation of the growth of oxide layer of stainless steels..:

Lan, Kuan-Che ; Chen, Yitung ; Hung, Tzu-Chen..
Computational Materials Science. 77 (2013) - p. 139-144 , 2013

Link: https://doi.org/10.1016/..