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2024 47th International Spring Seminar on Electronics Technology (ISSE) ,
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Board Level Underfill – Moisture Related Voids:
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2023 46th International Spring Seminar on Electronics Technology (ISSE) ,
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Board Level Underfill – the Influence of Flux:
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2023 46th International Spring Seminar on Electronics Technology (ISSE) ,
5
Study of Whisker Growth from SAC0307-SiC Composite Solder A..:
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2022 45th International Spring Seminar on Electronics Technology (ISSE) ,
8
Tin Whisker Susceptibility of SAC0307-ZnO Composite Solder ..:
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2020 43rd International Spring Seminar on Electronics Technology (ISSE) ,
15