Hwang, HowYuan
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Demonstration of Micro-transfer Printing Thick Optical Comp..:

, In: The 25th European Conference on Integrated Optics; Springer Proceedings in Physics,
 
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Reliability Investigation of Cu/In TLP Bonding:

Lee, Jong-Bum ; Hwang, How-Yuan ; Rhee, Min-Woo
Journal of Electronic Materials.  44 (2014)  1 - p. 435-441 , 2014
 
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