Hwang, Sheng-Jye
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3

Fan-out panel-level package warpage and reliability analyse..:

Liang, Chia-Wei ; Sung, Yu-Chi ; Hwang, Sheng-Jye...
Journal of Manufacturing Processes.  119 (2024)  - p. 649-665 , 2024
 
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4

Directed energy deposition process optimization and factor ..:

Qiu, Jun-Ru ; Chen, Yu-Xiang ; Hwang, Yi-Kai..
The International Journal of Advanced Manufacturing Technology.  132 (2024)  11-12 - p. 5329-5350 , 2024
 
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6

A Study of Underfill Dispensing Patterns in Flip-Chip Packa..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Chen, Dao-Long ; Chang, Hui-Jing ; Chen, Tang-Yuan... - p. 115-116 , 2023
 
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11

Multi-objective optimization of directed energy deposition ..:

Chang, Yu-Yang ; Qiu, Jun-Ru ; Hwang, Sheng-Jye
The International Journal of Advanced Manufacturing Technology.  120 (2022)  11-12 - p. 7547-7563 , 2022
 
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12

Nozzle Pressure and Clamping Force Based Injection Molding ..:

, In: 2022 25th International Conference on Mechatronics Technology (ICMT),
 
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15

Correlation Between Fiber Orientation and Geometrical Shrin..:

Huang, Chao-Tsai ; Wang, Jun-Zheng ; Lai, Cheng-Hong...
International Journal of Precision Engineering and Manufacturing-Green Technology.  10 (2022)  4 - p. 1039-1060 , 2022
 
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