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2023 International Conference on Electronics Packaging (ICEP) ,
1
Stress relaxation structure using Ni nano-particle/Al micro..:
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Lecture Notes in Electrical Engineering; Emerging Electronic Devices, Circuits and Systems ,
2
Origin of Hump in Ids for Body-Tied SOI-MOSFET and Its Infl..:
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New Advances in Mechanisms, Mechanical Transmissions and Robotics; Mechanisms and Machine Science ,
12
Relationship Between Rotational Angle and Time-Synchronous-..:
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Advances in Mechanism and Machine Science; Mechanisms and Machine Science ,
14